Presentation: Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 8 & 16, 2020)
Wafer Level Packaging (WLP) and the movement to Panel Level Packaging (PLP) have gained industry attention as more cost-effective packaging technologies for certain applications. In both cases the molding poses technical challenges in terms of understanding the optimum mold compound behavior in terms of flowability and warpage aspects, in order to limit process failure. The increased size adaptation (wafer size above 300mm or panel larger than 300mmx300mm) expands the assembly molding challenges even further. A greater understanding is needed about the flowability fundamentals of mold compounds and their impacts on quality and, potentially, warpage of the wafer/panel for subsequent processes.
Project ObjectivesThis project will:
PresentationsExperimental Study of Panel Level Packaging Warpage, presented by Diane Ecoiffier (Insidix France), Electronics System-Integration Technology Conference (ESTC) 2020 virtual conference (September 15-18, 2020). paper presentation
Call-for-participation webinar (March 8, 2018)
For Additional InformationHaley Fu, firstname.lastname@example.org