Advancing Manufacturing Technology

Presentations from Substrate & Package Technology Workshop

These are presentations from the iNEMI Substrate & Package Technology Workshop:  Road to Integrated SiP Package Technology Innovation, hosted by IBM in Singapore (May 26-27, 2016).
 
These presentations are available to workshop attendees and iNEMI members only.  If you are an iNEMI member, please log into your account or create a web account to view.  If you attended the workshop and need these presentations, please contact dtaylor@inemi.org.

Workshop Program
Includes Agenda, Speaker Bios/Abstracts

iNEMI & Workshop Overview
Haley Fu, Managing Director, iNEMI
 
An Overview of Market and Technology Trends in the Advanced Packaging Ecosystem
Santosh KUMAR, Sr Analyst, Yole Developpement
 
Package Scaling and Heterogeneous Integration
Wei Keat Loh, Sr Technology Development, Engineering Manager, ATTD, Intel
 
Solder Alloy Options for the Semiconductor and PCB Assembly
Sze Pei Lim, Regional Product Manager – Semiconductor, Indium Corp.
 
Device Embedded Package MCeP for SiP Application
Tetsuya Koyama, Manager of Interconnect Technology Development, Shinko
 
Wafer/Panel Level Encapsulation - an Alternative Format for Plastic Packaging: Its Challenges and Solutions
Eric Kuah, VP, Technology Encapsulation, Solutions Group, ASM Singapore
 
An End User's Perspective on Qualifying New Packaging Technologies
Curtis Grosskopf, Senior Engineer, System Supply Chain Engineering, IBM
 
eWLB /FO-WLP:  Present and Future of Advanced Wafer Level Packaging Technology
SW Yoon, Director / Products & Technology Marketing, STATS ChipPAC
 
Advanced Substrate Materials for Next Generation Low CTE/Thinner Package with High Reliability
Hiroaki Fujita, Hitachi Chemical
 
Enabling Ultimate Miniaturization and Customization with the Latest SiP Module Technology
L.C. Tan, Head, Assembly Process Innovation, NXP Semiconductors
 
High End Organic Substrate Direction
Koichi Nonomura, Manager of FCBGA Product Engineering, KYOCERA
 
Innovative SiP Technology
Stanley Wu, Technical Manager, ASE
 
Heterogeneous Integration Platforms for Mobile and IoT
Surya Bhattacharya, Director, A*STAR Institute of Microelectronics (IME)*

Molded Interconnect Substrate (MIS)
ASM Pacific Technology