Advancing Manufacturing Technology

Urmi Ray, Project Manager

 

 

Prior to joining iNEMI, Urmi was Senior Director at JCET Group, focused on advanced system-in-package (SIP) technologies. Prior to JCET Group, she was as a Principal Engineer for Qualcomm, where she was the technology and program lead in several forward-looking programs in 3D and 2.5D, system integration and fan-out wafer level packaging with particular focus on low-cost packaging for the mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in New Jersey, working on advanced materials and reliability for a diverse set of product portfolios, from consumer products to high-reliability telecommunications projects.

Urmi has a PhD from Columbia University (New York City).