Chair: Richard Kubin, E2open
Co-chair: Marissa Yao, Intel Corporation
The WEEE and RoHS directives, which go into effect in 2006, both require that manufacturers track and report the material composition of their products. Given the distributed nature of today's electronics industry, these new requirements will impact all elements of the value chain worldwide. A standard approach to materials composition declarations, including data collection and exchange, will reduce the cost and complexity of compliance and make a more efficient and effective process for the overall supply chain.
This project worked with international standards bodies to help define and validate standards for the exchange of material composition data among all elements of the value chain and across the entire product lifecycle. The group focused on standard data formats and transfer protocols, including support for bulk material, component, sub-assembly and finished product level reporting. Their objective was to automate data exchange query and response where possible, while also supporting human interaction. This project worked closely with the iNEMI RoHS Materials Declarations Project, and the recommendations from the two projects served as the basis for IPC-1752, Materials Declaration Management, which defines a data collection process flow and data format for industry-standard material composition data exchange. The IPC standard is expected to be published in early 2006.
DRAFT Statement of Work (v1.0, July 21, 2004)
STANDARD: IPC-1752, Materials Declaration Management
iNEMI/IPC Meeting at Productronica Focuses on Implementation of Materials Composition Data Exchange Standards (11/1/05)
The IPC-1750 Series: A Family of Supplier Declaration Standards (6/10/05)
New Standard to Provide Efficient Mechanism for the Exchange of Materials Content Information (4/20/05)
Tracking Material Composition Data, Richard Kubin, E2Open, and Nancy Bolinger, Lenovo International, Printed Circuit Design & Manufacture and Circuits Assembly, June 2005.
Roadmap to Compliance: The role of electronic data exchange in supporting the European Union RoHS and WEEE directives, Richard Kubin, E2open, Global SMT & Packaging, May 5, 2005.
JOINT INDUSTRY GUIDE for Material Composition Declaration of Electronics Product (final). This guide, from EIA (Electronic Industries Alliance), JGPSSI (Japan Green Procurement Survey Standardization Initiative) and JEDEC, establishes the materials and substances that must be disclosed by suppliers to meet RoHS requirements.
Format comparison: Joint Industry Guide/Compliance Connect/PDX 2.0/RosettaNet/JGPSSI (Excel spreadsheet)
Materials Declaration Data Exchange Proposal, Bob Pfahl, NEMI
Environmental Lifecycle Information Management - Need for Standardisation (CARE 2002 ELIMA standard)
Green Procurement Basic Information Survey (Chemical Substances) Ver2.00, JGPSSI and NEC Soft, Ltd. (Excel spreadsheet)
Sample component material declaration sheets from ZVEI (Umbrella Specification Product Content Sheet and Package Weight List)
Product content sheet: P-DSO (Infineon)
Specialty Polymer Aluminium Electrolytic Capacitor: SMD (Panasonic)
Aluminium Electrolytic Capacitor: Axial
Aluminium Electrolytic Capacitor: Radial
Aluminium Electrolytic Capacitor: Screw
Aluminium Electrolytic Capacitor: SMD
Aluminium Electrolytic Capacitor: Snap-in