Advancing Manufacturing Technology

Presentations & Papers

TYPES

iNEMI Forums, Workshops, and Symposia
Whitepapers & Position Statements
Project Webinars & Reports
Conference Papers and Presentations
iNEMI Research Seminar Series
UL Webinar Series
 

TOPICS

Automotive
Board Assembly
Environment
Medical Electronics
MEMS
Optoelectronics
Organic PCB & Packaging
PCBs
Power Conditioning
Roadmap
Test

 

Automotive

Automotive Electronic Material Challenges End-of-Project WebinarRecording (35 mins) (March 17, 2016)

Follow-up webinar to iNEMI/SMTA Automotive Electronics Workshop:  Electronic Material Challenges for Vehicles of the Future held on October 5, 2015 in Dresden, Germany (November 5, 2015).  (Open to industry; must be logged into your web account to view).

iNEMI/SMTA Automotive Electronics Workshop: Electronic Material Challenges for Vehicles of the Future (October 5, 2015; Dresden, Germany) (iNEMI members only)

iNEMI Automotive Webinar: What's Down the Road for Automotive Electronics Manufacturing? (October 16, 2013)

iNEMI Workshop: What's Down the Road for Automotive Electronics Manufacturing? (September 9, 2013; Grenoble, France) (iNEMI members only)

Board Assembly

iNEMI Study on Board Creep Corrosion, presented by Haley Fu (iNEMI) at the CEEDI (China Electronics Engineering Design Institute) Technical Seminar on Data Center IT Equipment Corrosion by Gaseous Contamination and Measures (Beijing, China; April 24, 2012).

iNEMI Experimental Investigation on Creep Corrosion, presented by Haley Fu (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 19, 2012)

iNEMI Solder Paste Deposition Project Report‚ Laye Feng (Huawei Technologies), SMTA China South Technical Conference (August 31, 2010; Shenzhen, China). paper (English) presentation (Chinese)

iNEMI Solder Paste Deposition Project Report, Cherie Chen (IST), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21; Taipei, Taiwan) paper presentation

iNEMI Solder Paste Deposition Project-First Stage Review - Optimizing Solder Paste Printing for Large and Small Components, Laye Feng (Huawei Technologies), SMTA South China, August 26, 2009, Shenzhen.

iNEMI White Paper on Development of a Methodology to Determine Risk of Counterfeit Use (October 2013)

iNEMI Position Statement on the Limits of Temperature, Humidity and Gaseous Contamination in Data Centers and Telecommunication Rooms to Avoid Creep Corrosion on Printed Circuit Boards (April 2012)

Counterfeit Components - Assessment Methodology and Metric Development - End-of-Project Report (October 15, 2013) (iNEMI members only)

Creep Corrosion End-of-Project Webinar, Phase 3 (November 5-6, 2012) (iNEMI members only)

Solder Paste Deposition, Phase 1 (October 13-14, 2010)

iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (August 5, 2009)

Nano-Solder Project (February 4, 2009)

Nano-Attach Project (December 17, 2008)

Pb-Free BGAs in SnPb Assembly Process Project (August 28, 2008)

Pb-Free Wave Soldering Project Phase 1 (October 4, 2007)

Pb-Free BGAs in SnPb Assemblies Project Phase II (October 4, 2007)

Lead-Free Assembly & Rework Project (April 4, 2005)

Evaluation of Pb-Free Component & Board Finish Reliability, FInal Report (December 19, 2012) (iNEMI members only)

Pb-Free BGAs in SnPb Assembly Process Project (August 28, 2008)

Qualification Test Development for Creep Corrosion, Phase 1, End-of-Project Webinar (April 21, 2014) (iNEMI members only)

Pb-Free Rework Optimization, Phase 3 (March 12, 2014) (available to both members and non-members)

PCBA Reliability Qualification (February 27-28, 2014) (available to both members and non-members)

Environment

Sustainable Electronics, presented by Bob Pfahl (iNEMI), to the Sustainable Electronics Forum (October 17, 2012; Wingspead, Wisconsin). The Forum was sponsored by the U.S. Environmental Protection Agency, The Green Electronics Council, and the Johnson Foundation at Wingspread.

iNEMI Pb-Free Electronics Activity, presented by Robert Pfahl (iNEMI), Pb- Free Electronics Risk Management (PERM) Consortium Meeting No. 13 (National Electronics Museum; Linthicum Heights, Maryland; July 31, 2012)

Data Assessment and Collection for a Simplified LCA Tool, Thomas Okrasinski (Alcatel-Lucent), John Malian (Cisco) and James Arnold (iNEMI), presented by Tom Okrasinski, Carbon Management Technology Conference (February 7-9, 2012; Orlando, Florida) paper presentation

Environmental Accomplishments and Opportunities, Bob Pfahl (iNEMI), 2011 ISSST (05/16/11; Chicago, Illinois)

Industry Collaboration Driving Proactive Environmental Improvements (distributed to participants of SAICM Workshop; 3/29/11; Vienna, Austria)

iNEMI HFR-Free Programs (presented at ENFIRO Conference, 3/15/11; Amsterdam, The Netherlands)

iNEMI Panel Session (November 9, 2010), Going Green — CARE Innovation 2010 (November 8-11, 2010; Vienna, Austria)

iNEMI HFR-Free Leadership Project Report, Stephen Tisdale (Intel), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21, 2010; Taipei, Taiwan) paper   presentation

Toward a Sustainable World through Electronic Systems and Information Technology, Bob Pfahl (iNEMI), Innovation in Computing and Information Technology for Sustainability, Computer Science & Telecommunication Board Workshop, National Academy of Sciences (May 26, 2010; Washington, D.C.)

“The Evolving Direction for Environmental Programs in the Electronics Industry,” Robert C. Pfahl (iNEMI), Systems Packaging Japan Workshop 2010 (January 25, 2010; Kyoto, Japan)

Industry Transition to Halogen-free Platforms, John Davignon (Intel) and Robert Pfahl (iNEMI), IDF2009 (Intel Developer Forum), September 22, 2009; San Francisco, California

iNEMI HFR-Free Program Introduction, Haley Fu (iNEMI), SMTA South China, August 26, 2009, Schenzen. (This paper received recognition as the Best Paper of Technology Conference Two and was also presented at ICEPT- HDP, August 13, 2009; Beijing, China).
paper — English
paper — iNEMI æ— å¤åŒ–阻燃剂项目报告
presentation

Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives, Gregory Henshall (Hewlett-Packard); Robert Healey, Ranjit S. Pandher (Cookson Electronics); Keith Sweatman, Keith Howell (Nihon Superior); Richard Coyle, Joe Smetana (Alcatel Lucent); Thilo Sack, Polina Snugovsky (Celestica); Stephen Tisdale, Fay Hua (Intel) and Grace O'Malley (iNEMI); presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 16, 2009; Rimini, Italy)

Conversion to Non-Halogenated Flame Retardants in Electronics, presented by Bob Pfahl and translated by Haley Fu (both iNEMI), part of a high-level business forum sponsored by Reed Exhibitions and co-sponsored by iNEMI, held in conjunction with NEPCON Shanghai/SMTA China East Technical Conference (April 22, 2009; Shanghai)

iNEMI Pb-Free and HFR-Free Forum, APEX 2009 (April 2; Las Vegas, Nevada)

iNEMI Pb-Free Alloy Characterization Papers at SMTA 2012 (as originally published in the 2012 SMTA International Conference Proceedings) (Orlando, Florida; October 17, 2012)

White Paper: Rare Earth Metals -- Current Status & Future Outlook

iNEMI White Paper on Harmonization of Environmental Data Management (December 2012)

iNEMI White Paper on PVC Alternatives (December 2012)

iNEMI Product Carbon Footprint (PCF) Position Statement (October 2010)

iNEMI Whitepaper on Lifecycle Assessment (April 2010) (iNEMI members only)

iNEMI Timeline for HFR-Free Electronics & PVC-Free Cabling (February 27, 2010)

iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)

Introduction to oManual, IEEE 1874, The Open Manual Format, webinar presented by Daniel Elsenman (Cisco), Kyle Wiens (iFixit), Mark Schaffer (Schaffer Environmental). Recording (August 14, 2014)

Impact of Green Mold Compounds on First-and Second-Level Interconnect Reliability, webinar presented by imec (January 30, 2013)

Reducing HFRs and PVC in the Electronics Supply Chain (iNEMI webinar held August 1 and August 29, 2011)

iNEMI Environmental Projects: Progress and Results, APEX 2011 (April 14, 2011; Las Vegas, Nevada)

HFR-Free Project Updates, Bob Pfahl (iNEMI)

Eco-Impact Evaluator for ICT Project Updates, Jim Arnold (iNEMI)

PVC Alternatives Project Updates, Jim Arnold (iNEMI)

2010 Environmental Research Stakeholders Forum (available to members only; November 8, 2010; Vienna, Austria)

HFR-Free Leadership Meeting (April 15, 2010; Taipei, Taiwan)

Highlights from the 2009 iNEMI Environmentally Concious Electronics Roadmap:  Creating a Better World Through Electronics, Bill Bader, iNEMI; Grace O'Malley, iNEMI; Jos Beekwilder, Océ Technologies; Markus Stutz, Dell

Symposium on Global ICT Environmental Initiatives (October 27-28, 2009; Brussels, Belgium)

Environmental Leadership Forum (October 8, 2009; San Diego, California)

Conversion to Non-Halogenated Flame Retardants in Electronics, presented by Bob Pfahl and translated by Haley Fu (both iNEMI), part of a high-level business forum sponsored by Reed Exhibitions and co-sponsored by iNEMI, held in conjunction with NEPCON Shanghai/SMTA China East Technical Conference (April 22, 2009)

iNEMI Pb-Free and HFR-Free Forum, APEX 2009 (April 2, 2009; Las Vegas, Nevada)

PVC Alternatives Project, Phase 1 Final Project Team Report (September 12, 2011) (iNEMI members only)

Eco-Impact Evaluator, Phase 2 (LCA Estimator for ICT Products) (October 17, 2012)

HFR-Free High Reliability PCB Project, Project Webinar (October 4, 2012) (iNEMI members only)

HFR-Free PCB Materials, Project Webinar (February 21, 2012) (iNEMI members only)

Eco-Impact Evaluator for ICT Equipment, Project Webinar (December 3, 2010) (iNEMI members only)

Pb-Free Wave Soldering, Phase 2 (October 14, 2010)
 
Tin Whisker Accelerated Test Project Phases 1-5 (June 10, 2009) (iNEMI members only)

BFR-Free PCB Material Evaluation Project (September 17, 2008)

Materials Composition Data Exchange Project (December 8, 2005)

PVC Alternatives Interim Report (November 30, 2010) (iNEMI members only)

iNEMI Tin Whisker Team End-of-Program Report, Richard Parker (Delphi), presented at iNEMI Fall Council meeting (October 28, 2010; Orlando, Florida) (iNEMI members only)

Rare Earth Metals Survey Summary (August 23, 2010) (iNEMI members only)

BFR-Free PCB Project- Phase II (Material Evaluation) (August 8, 2008)

Lead-Free Assembly & Rework Project (June 2005)

Lead-Free Assembly Project (December 2003)

Metals Recycling (July 8, 2014)

Alternative Materials (June 26, 2014)

Repair & Recycling Metrics (June 25, 2014)

Medical Electronics

2013 SMTA/iNEMI Medical Electronics Symposium, November 12-13; 2013 (Milpitas, California)

Closing Technology Gaps for the Medical Electronics Industry - iNEMI Medical Project and Initiative Review, presented by Chuck Richardson (iNEMI), MEPTEC & SMTA 2012 Medical Electronics Symposium, September 27, 2012 (Arizona State University)

Closing Technology Gaps for the Medical Electronics Industry, Jim McElroy (iNEMI), 2011 Medical Electronics Symposium: Vital Technologies for Health (sponsored by MEPTEC and SMTA), September 27, 2011 (Arizona State University, Tempe Arizona)

Failure Mechanisms, Acceptance Criteria, and Accelerated Test Procedures for Electronic Components Used in Active Implantable Medical Devices: Capacitors, iNEMI Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project, presented by Grady White, NIST, SMTA/MEPTEC 2009 Medical Electronics Symposium, September 16-17, 2009 (Arizona State University, Tempe, Arizona).

Medical Electronics Workshop (May 4-5, 2011; Santa Clara, California)

Medical Electronics Workshop (September 16-17, 2010; Berlin, Germany) (not available on-line; contact Grace O'Malley to obtain.)

Automotive & Medical PEGs, 2011 Roadmap — European Webinar (March 19, 2010)

Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project (March 31, 2010)

Medical Components Reliability Specifications Project (November 6, 2008)

Assessment of Reliability Standards and Test Methods for Implantable Medical Devices (July 23, 2014)

Qualification Methods for Portable Medical Products (March 27, 2014)

Component Specifications for Medical Products (March 25, 2014)

MEMS

MEMS Packaging: Transforming the Challenges into Solutions, presented by Chuck Richardson, Director of Roadmapping (iNEMI) and Bill Bottoms (3MTS and iNEMI/ITRS & Packaging TWG Chair); webinar was hosted by MIG

Forums, Workshops, and Symposia

iNEMI MEMS Workshop: Driving Next-Level Results Through Collaboration (May 10, 2012; Pittsburgh, Pennsylvania)

Optoelectronics

Presentations from iNEMI meeting at OFC/NFOEC 2012 (March 18, 2013; Anaheim, California).

Presentations from iNEMI meeting at OFC/NFOEC 2012 (March 5, 2012; Los Angeles, California).

“Contamination Effects on Optical Performance for Short Reach 10Gb/s SFP+ Transceivers,” Fiber Connector End-Face Inspection Project team, Poster Session II, OFC/NFOEC (March 24, 2010; San Diego, California).

Contamination Effects on Lens-Based Optics Modules: Modeling and Experimental Analysis, Christine Chen (Avago Technologies), Yutaka Sadohara (Sumitomo Electric), Tatiana Berdinskikh (Celestica International Inc.), David Fisher (Tyco Electronics), Sun-Yuan Huang (Emcore Corp), Brian J. Roche and Beth Coviello (Cisco Systems Inc.), and Douglas H. Wilson (PVI Systems Inc.), poster session at OFC/NFOEC 2009, March 26 (San Diego, California).

iNEMI Optical Device Inspection & Cleaning Program - Connector Particles Thickness Project, OFC/NFOEC 2011 (March 7, 2011; Los Angeles, California)

Fiber Connector Endface Inspection Project Phase 2 (March 23, 2009)

Fiber Connector End-Face Inspection (January 24, 2007)

2006 iNEMI Optoelectronic Substrates Project Report (November 2, 2006) (iNEMI members only)

Organic PCB & Packaging

iNEMI Substrate & Package Technology Workshop:  Road to Integrated SiP Package Technology Innovation (Singapore; May 26-27, 2016).  Follow-up webinar (July 12-13, 2016)

Challenges to Increasing Wiring Density for Organic Packaging Substrates, presented by Masahiro Tsuriya (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 20, 2012)

iNEMI Investigations Focus on Copper Wire Bonding, presented by Haley Fu (iNEMI) at SMTA (April 25, 2012; Shanghai, China).

Current Industry Adoption of Fine-Pitch Cu Wire Bonding and Investigation Focus at iNEMI, presented by Grace O'Malley (iNEMI), at European Microelectronics Package Conference (EMPC), (September 2011; Brighton, England)
Technology Trends & Roadmaps for Package Innovation (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26, 2011; Cambridge, UK)

iNEMI Projects Addressing High-Complexity Packaging and Test Challenges (presented at Smart Systems Integration Conference; 3/23/11; Dresden, Germany)

iNEMI Packaging & Substrate Technology Workshop (April 22-23, 2014; Toyama, Japan)

iNEMI Packaging Substrates Workshop (November 17-18, 2009; Nagoya, Japan)

Improving UL Certification of Laminates and Printed Circuit Boards (November 20, 2013)
 
Wiring Density for Organic Packaging Substrates (December 6, 2012) (iNEMI members only)
 
Connector Particle Thickness Investigation (December 4, 2012) (iNEMI members only)

Copper Wire Bonding, Phase 2 (March 27, 2014)

PCBs

iNEMI PCB/Laminates Workshop (October 22, 2013; Taipei, Taiwan) (link for members only) (attendees have a different link; contact dtaylor@inemi.org for assistance)

Power Conditioning

DC-DC Power Module Phase 1 End-of-Project Webinar, presented by David Mohr (HP) (October 30, 2014) (iNEMI members only)

DC-DC Power Module Phase 1 End-of-Project Webinar , persented by David Mohr (HP) (October 30, 2014) (public version)

Roadmap

iNEMI Roadmap Activities In Emerging Technologies, presented by Chuck Richardson (iNEMI) (Orlando, Florida; October 15, 2012)

iNEMI Roadmap Issues In EmergingTechnologies Panel Discussion (iNEMI members only file), presented by Chuck Richardson (iNEMI) (Orlando, Florida; October 15, 2012)

The iNEMI Roadmap– A Systems Approach to Closing Technology Gaps, presented by Jim McElroy (iNEMI) at the CMC Symposium (October 11, 2012; Toronto, Canada)

Highlights from iNEMI's Roadmap Activities, presented by Chuck Richardson (iNEMI) at ITRS Summer Meeting, (July 9, 2012; Monterey, California)

Highlights from iNEMI's Roadmap Activities, presented by Grace O'Malley (iNEMI) at ITRS More than Moore Workshop (April 25, 2012; Noordwijkerhout, The Netherlands)

2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission, presented by Chuck Richardson (iNEMI) at CARTS International (March 26, 2012; Las Vegas, Nevada)

iNEMI Roadmap Process & Industry Collaboration Projects to Close Roadmap Gaps, Bill Bader (iNEMI), presented at IMAPS Global Business Council (March 5, 2012; Scottsdale, Arizona)

Future Challenges for Electronics Manufacturing: Highlights from the iNEMI Technology Roadmap, Grace O’Malley (iNEMI), Zuken Engineering Day UK (ZEDUK)(November 2, 2011; Cosford, Shropshire, UK).

iNEMI Flexible Electronics Roadmap, Dan Gamota (Printovate), Workshop on Nanofabrication Technologies for Roll-to-Roll Processing(September 27, 2011; Boston Massachusetts)

KEYNOTE: Highlights of 2011 iNEMI Technology Roadmap, presented by Bill Bader (iNEMI),September 13,2011, European Microelectronics Package Conference (EMPC), Brighton, England.

Technology Trends & Roadmaps for Package Innovation" (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26,2011; Cambridge, UK)

“iNEMI Roadmap Highlights,” Chuck Richardson (iNEMI), SMTAI 2010 (October 27; Orlando, Florida)

“iNEMI Flexible Electronics Roadmap– From Concept to Product,” Daniel Gamota (Printovate), National Academies Symposium (September 24, 2010; Washington, D.C.)

"iNEMI Roadmap for Solid State Illumination‚" Haley Fu (iNEMI), ICEPT-HDP (August 18, 2010; Xi'an, China) paper presentation

“iNEMI Roadmap Highlights,” Haley Fu (iNEMI), SEIPI General Membership meeting (July 23, 2010; Baguio, Philippines)

Passives— The Road Ahead (highlightsfrom the Passives Chapter of the2009 iNEMIRoadmap), Grace O’Malley (iNEMI), Workshop on PassiveTechnology, TC40 meeting, Cambridge, UK, September 9,2009.

Closing Technology Knowledge Gaps — Projects Arising from the iNEMI Technology Roadmap, Bob Pfahl, Jim Arnold and Grace O'Malley (iNEMI), presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 18, 2009; Rimini, Italy)

iNEMI Roadmap Process for Communicating Requirements from OEMsto Suppliers, Grace O’Malley, 10th JIC (JISSO International Council) meeting, May 19, 2009 (held at LETI/Minatecin Grenoble, France).

2009 iNEMI Roadmap (keynote), Grace O’Malley (iNEMI), Astride the Packaging Roadmap Seminar, held at TWI Limited, April 22, 2009 (Cambridge, United Kingdom).

2009 iNEMI Roadmap Keynote and Chapter Discussions, NEPCON Shanghai/SMTA China East Technical Conference (April 21, 2009; Shanghai)

2009 iNEMITechnology Roadmap Forum, APEX 2009(March 31; Las Vegas, Nevada)

The 2009 iNEMI Roadmap for Solid State Illumination (SSI), presented by Marc Chason (consultant),at the FlexTech Alliance’s 8th Annual Flexible Electronics & Displays Conference (Session 9: Solid State Lighting & Flexible OLEDs), February 4, 2009 (Phoenix, Arizona).

2013 Roadmap

iNEMI/IPC Board Assembly Highlights from 2013 iNEMI and IPC Roadmaps, presented by Paul Wang (Mitac), Keith Howell (Nihon Superior), and Jasbir Bath (IPC), to SMTA Silicon Valley Chapter Meeting (December 5, 2013; San Jose, California)

iNEMI 2013 Technology Roadmap, presented by Grace O'Malley, iNEMI, at the iNEMI-EIPC Workshop at Productronica (November 13, 2013; Munich, Germany)

Highlights of the Mass Data Storage Chapter of the 2013 iNEMI Roadmap, webinar presented by Roger Hoyt, Principal, Hoyt Associates (August 30, 2013)

Highlights of the Passive Components Chapter of the 2013 iNEMI Roadmap, webinar presented by Ed Mikoski, Vice President, EIA Standards and Technology, ECIA (August 23, 2013)

Highlights of the Electronic Connectors Chapter of the 2013 iNEMI Roadmap, webinar presented by John MacWilliams, Principal Consultant, Bishop & Associates (August 2, 2013)

Highlights of the Optoelectronics Chapter of the 2013 iNEMI Roadmap, webinar presented by Dick Otte, CEO of Promex (July 26, 2013)

Highlights of the 2013 iNEMI Roadmap, Webinars (April 1 and April 4, 2013)

Highlights of iNEMI 2013 Technology Roadmaps, presented by Chuck Richardson (iNEMI), Pan Pacific Microelectronics Symposium (January 22- 24, 2013; Maui, Hawaii)

2013 Product Emulator Group (PEG) Presentations, Webinar (May 17, 2012)

2011 Roadmap

Highlights of the 2011 iNEMI Roadmap, Webinar (March 29, 2011)

Automotive & Medical PEGs, 2011 Roadmap — European Webinar (March 19, 2010)

Highlights from the 2009 iNEMI Environmentally Conscious Electronics Roadmap (December 15, 2009)

2009 iNEMI Technology Roadmap Forum, APEX 2009 (March 31, 2009; Las Vegas, Nevada)

Test

Board Assisted BIST: Long and Short Term Solutions for Testpoint Erosion – Reaching into the DfX Toolbox, presented by Zoe Conroy (Cisco) to International Test Conference (ITC) (Anaheim, California; November 8, 2012)

iNEMI Projects Addressing High-Complexity Packaging and Test Challenges (presented at Smart Systems Integration Conference; 3/23/11; Dresden, Germany)

Built-In Self-Test (BIST) Survey – An Industry Snapshot of HVM Component BIST Usage at Board and System Test, Zoë Conroy (Cisco), Hui Li and Jun Balangue (Agilent Technologies), IEMT Conference (November 30 – December 2, 2010; Melaka, Malaysia)

Report on iNEMI Boundary-Scan Adoption Project and Future Plans, Philip B. Geiger (Dell Inc.), Steve Butkovich (Cisco Systems Inc.), Haley Fu and Grace O’Malley (iNEMI), ESTC 2010 (Electronics Systems Integration Technology Conference) September 13-16, 2010, Berlin)

Boundary-Scan Adoption – An Industry Snapshot with Emphasis on the Semiconductor Industry, Philip B. Geiger, Dell Inc., and Steve Butkovich, Cisco Systems Inc., International Test Conference (November 1-6, 2009; Austin, Texas).

iNEMI Test TIG Meetings, APEX 2010 (April 8, 2010; Las Vegas, Nevada)

Structural Test of External Memory Devices (Boundary Scan Adoption Project, Phase 2), End-of-Project Webinar (May 24, 2012) (iNEMI members only)

Built-In Self-Test (BIST), Phase 2 (December 14, 2011)

Board Coplanarty in SMT (August 23, 2011)

Board Flexure Standardization (August 4-5, 2011),

Built-In Self-Test (BIST), Phase 1 (July 14 2010)

Board Flexure Standardization Project (January 20, 2010)

Boundary Scan Adoption Project (October 20, 2009)

Functional Test Coverage Assessment (August 12, 2009)

DPMO Project (February 16, 2005)

Boundary Scan, Phase 2 (May 7, 2014)

Built-In Self-Test (BIST), Phase 3 (May 7, 2014)