HERNDON, VIRGINIA (September 15, 2009) — The International Electronics Manufacturing Initiative (iNEMI) is planning a two-day workshop to identify gaps and challenges related to organic substrate technology. The meeting will bring together leading original equipment manufacturers (OEMs), packaging firms and substrate providers to discuss technology requirements that must be addressed in order to facilitate continued miniaturization of electronics packaging.
“The packaging substrate provides significant potential for innovation but, at the same time, it is the most expensive component in advanced packages,” said Mario A. Bolanos, strategic packaging research and university collaborations manager for Texas Instruments and chair of the iNEMI Packaging Substrates Workshop. “Major innovations are needed to generate new disruptive technologies that will not only close technology gaps but also push us to the next generation of organic substrates. Now is the time for industry-level action, and iNEMI is sponsoring this workshop to help build industry consensus on the critical gaps and identify opportunities to address them. The ultimate goal is to prevent organic substrate technology from becoming a limiting factor in the continued growth of electronics.”
On day one, a series of speakers will address various packaging-related topics such as next-generation product sector needs, assembly challenges and emerging packaging formats. On the second day, working teams will address key topics identified during the first day, and formulate potential industry action plans. The agenda includes confirmed speakers from: