Advancing Manufacturing Technology
Members
PEG Workshop/TWG Kickoff Meeting Agenda
Preliminary Agenda
iNEMI PEG Workshop / TWG Kickoff MeetingFLEX Campus
847 Gilbratar Drive
Building 5
Milpitas, California 95035
February 10-11, 2016
This face-to-face meeting is open to industry. If you can't be there in person, you can attend via WebEx.
There are separate registrations for in person and WebEx.
More information, including registration.
| Wednesday, February 10 |
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| Time (PST) | Subject | Presenter |
|
10:00 a.m. |
Registration for Tour Event and Meetings |
|
|
10:30 |
Site Tour Event |
|
|
11:30 |
Registration for Meetings Only |
|
|
12:00 p.m. |
Lunch |
|
|
12:30 |
Welcome, Agenda/Overview |
Murad Kurwa, Flex |
|
1:30 - 5:30 |
Product Emulator Group Presentations |
|
|
1:30 |
Portable / Wireless |
Kartik Ananth, Intel |
|
2:00 |
High-End Systems |
Dale Becker, IBM |
|
2:30 |
Automotive |
Sam Platt, Delphi |
|
3:00 |
Break |
|
|
3:30 |
Aerospace / Defense |
James Faoro, Raytheon |
|
4:00 |
Medical |
Don Banks, St. Jude Medical |
|
4:30 |
IoT |
Satish Parupalli, Intel |
|
5:00 |
Office / Consumer |
TBD |
|
5:30 p.m. |
Summary / Close |
Bill Bader, iNEMI |
| Thursday, February 11 |
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| Time | Subject | Presenter |
|
7:30 a.m. |
Continental Breakfast |
|
|
8:00 |
Introduction to Breakout Sessions |
Chuck Richardson, iNEMI |
|
8:30 - 11:45 |
Breakout Sessions (Follow TWG Signs) |
|
|
11:45 |
Summary |
Grace O'Malley, iNEMI |
|
12:00 p.m. |
Lunch |
|
|
1:00 |
Introduction to Reports |
Chuck Richardson, iNEMI |
|
1:15 - 5:00 |
Technical Working Group Reports |
|
|
|
Business Processes / Technologies: |
|
|
1:15 |
Information Management |
Gopal Rao, Consultant |
|
|
Design Technologies: |
|
|
1:25 |
Environmentally Sustainable Electronics |
Matthew Chalkley, IBM |
|
1:35 |
Modeling, Simulation & Design Tools |
TBD |
|
1:45 |
Thermal Management |
Azmat Malik, UC Berkeley |
|
|
Manufacturing Technologies: |
|
|
1:55 |
Board Assembly |
Paul Wang, Mitac |
|
2:05 |
Test, Inspection & Measurement |
TBD |
|
2:15 |
Final Assembly |
Richard Henrick, Sanmina |
|
|
Component Subsystem Technologies: |
|
|
2:25 |
Passive Components |
Ed Mikoski, ECIA |
|
2:35 |
RF Components & Subsystems |
Jason Coder, NIST |
|
2:45 |
Packaging & Component Substrates |
Raja Swaminathan, Intel |
|
2:55 |
Semiconductor Technology |
Paolo Gargini, ITRS |
|
3:05 |
Interconnect PCB (Organic) |
Marc Carter, SAIC |
|
3:15 |
Break |
|
|
3:30 |
Electronic Connectors |
John MacWilliams, Bishop |
|
3:40 |
Energy Storage |
Proamod Kulkarni, CES |
|
3:50 |
Optoelectronics |
Dick Otte, Promex |
|
4:00 |
MEMS / Sensors |
Michael Gaitan, NIST |
|
4:10 |
Hybrid Flexible Electronics |
Dan Gamota, Jabil |
|
4:20 |
Interconnect Substrates (Ceramic) |
Howard Imhof, Metalor |
|
4:30 |
Solid State Illumination |
Gyan Dutt, Alent |
|
4:40 |
Mass Data Storage |
Roger Hoyt, Consultant |
|
4:50 |
Power Conversion Electronics |
Conor Quinn, Dhaval Dalal, PSMA |
|
5:00 p.m. |
Summary / Close |
Chuck Richardson, Grace O'Malley, iNEMI |
PEG - Product Emulator Group
TWG - Technical Working Group
Register here for these meetings.
More information about these meetings.