Advancing Manufacturing Technology

Conference Papers and Presentations

By Conference

iNEMI Low-Temperature Solder Workshop (Shanghai, China; April 24, 2019)
iNEMI at IMPACT 2014 (Taipei, Taiwan; October 2014)
HIgh Performance Packaging - What Does the Future Hold, presented by Grace O'Malley (iNEMI), at High Performance Packaging Workshop (Oxford, UK; July 9, 2014)
Highlights from the iNEMI Thermal Management Technology Roadmap, presented by Grace O'Malley (iNEMI), at Eurotherm Seminar 102 - Thermal Management of Electronic Systems, University of Limerick (Limerick, Ireland; June 19, 2014).
iNEMI Roadmap and ITRS Plans for Collaboration Regarding “More Than Moore” Technology Beyond 2020, presented by Chuck Richardson, iNEMI; Paolo Gargini, ITRS, 225th ECS (Electro Chemical Society) Meeting (Orlando, Florida; May 12, 2014)
iNEMI Substrate & Packaging Technology Workshop (Toyama, Japan; April 22-23, 2014)
iNEMI at APEX 2014 (Las Vegas, Nevada; March 2014)
BA-BIST: Board Test from Inside the IC Out, Zoe Conroy, Cisco, presented at International Test Conference 2013 (Anaheim, California; September 11, 2013)
iNEMI at ICEPT 2013 (Dalian, China; August 11-14, 2013)
iNEMI at ICEP 2013 (Osaka, Japan; April 2013)
iNEMI at APEX 2013 (San Diego, California; February 2013)
iNEMI at IEMT 2012 (Ipoh, Perak, Malaysia; November 7, 2012)
iNEMI at SMTA International (Orlando, Florida; October 2012)
iNEMI Session at IMPACT 2012 (Taipei, Taiwan; October 26, 2012)
Pb-Free Electronics Risk Management (PERM) Consortium Meeting No. 13 (July 30 - August 2, 2012, iNEMI Pb-Free Electronics Activity, presented by Robert Pfahl (iNEMI) (National Electronics Museum; Linthicum Heights, Maryland; July 31, 2012)
Current and Future Needs for Polymeric Materials, keynote presented by Bob Pfahl (iNEMI) at the Symposium on Polymers for Microelectronics, The Fifteenth Meeting of the Symposium on Polymers for Microelectronics (Wilmington, Delaware; May 8, 2012)
ICEP-IAAC 2012 (Joint Conference of "International Conference on Electronics Packaging" and "IMAPS All Asia Conference") (Tokyo, Japan; April 17-20, 2012)
SMTA Pan Pacific Microelectronics Symposium (Kauai, Hawaii; February 14-16, 2012)

By Topic

Alternative Energy
 
Challenges of Solar Manufacturing, Alan Rae (TPF Enterprises), Session 24-Solar PV Module Assembly: Challenges & Opportunities, APEX 2010 (April 7; Las Vegas, Nevada)
Alternative Energy Workshop Results,  Jim McElroy (iNEMI), APEX 2011 (April 14, 2011; Las Vegas, Nevada)

Environment
 
Sustainable Electronics, presented by Bob Pfahl (iNEMI), to the Sustainable Electronics Forum (October 17, 2012; Wingspead, Wisconsin).  The Forum was sponsored by the U.S. Environmental Protection Agency, The Green Electronics Council, and the Johnson Foundation at Wingspread.
iNEMI Pb-Free Electronics Activity, presented by Robert Pfahl (iNEMI), Pb-Free Electronics Risk Management (PERM) Consortium Meeting No. 13 (National Electronics Museum; Linthicum Heights, Maryland; July 31, 2012)
Data Assessment and Collection for a Simplified LCA Tool, Thomas Okrasinski (Alcatel-Lucent), John Malian (Cisco) and James Arnold (iNEMI), presented by Tom Okrasinski, Carbon Management Technology Conference (February 7-9, 2012; Orlando, Florida)     paper     presentation
Environmental Accomplishments and Opportunities, Bob Pfahl (iNEMI), 2011 ISSST (05/16/11; Chicago, Illinois)
Industry Collaboration Driving Proactive Environmental Improvements (distributed to participants of SAICM Workshop; 3/29/11;  Vienna, Austria)
iNEMI HFR-Free Programs (presented at ENFIRO Conference, 3/15/11; Amsterdam, The Netherlands)
iNEMI Panel Session (November 9, 2010), Going Green — CARE Innovation 2010 (November 8-11, 2010; Vienna, Austria)
iNEMI HFR-Free Leadership Project Report, Stephen Tisdale (Intel), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21, 2010; Taipei, Taiwan)      paper        presentation
Toward a Sustainable World through Electronic Systems and Information Technology, Bob Pfahl (iNEMI), Innovation in Computing and Information Technology for Sustainability, Computer Science & Telecommunication Board Workshop, National Academy of Sciences (May 26, 2010; Washington, D.C.)
The Evolving Direction for Environmental Programs in the Electronics Industry,” Robert C. Pfahl (iNEMI), Systems Packaging Japan Workshop 2010 (January 25, 2010; Kyoto, Japan)
Industry Transition to Halogen-free Platforms, John Davignon (Intel) and Robert Pfahl (iNEMI), IDF2009 (Intel Developer Forum), September 22, 2009; San Francisco, California
iNEMI HFR-Free Program Introduction, Haley Fu (iNEMI), SMTA South China, August 26, 2009, Schenzen. (This paper received recognition as the Best Paper of Technology Conference Two and was also presented at ICEPT-HDP, August 13, 2009; Beijing, China).
    paper — English
    paper — iNEMI 无卤化阻燃剂项目报告
Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives, Gregory Henshall (Hewlett-Packard); Robert Healey, Ranjit S. Pandher (Cookson Electronics); Keith Sweatman, Keith Howell (Nihon Superior); Richard Coyle, Joe Smetana (Alcatel Lucent); Thilo Sack, Polina Snugovsky (Celestica); Stephen Tisdale, Fay Hua (Intel) and Grace O'Malley (iNEMI); presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 16, 2009; Rimini, Italy)
Conversion to Non-Halogenated Flame Retardants in Electronics, presented by Bob Pfahl and translated by Haley Fu (both iNEMI), part of a high-level business forum sponsored by Reed Exhibitions and co-sponsored by iNEMI, held in conjunction with NEPCON Shanghai/SMTA China East Technical Conference (April 22, 2009; Shanghai)
iNEMI Pb-Free and HFR-Free Forum, APEX 2009 (April 2; Las Vegas, Nevada)

Medical Electronics
 
2013 SMTA/iNEMI Medical Electronics Symposium, November 12-13; 2013 (Milpitas, California)
Closing Technology Gaps for the Medical Electronics Industry - iNEMI Medical Project and Initiative Review, presented by Chuck Richardson (iNEMI), MEPTEC & SMTA 2012 Medical Electronics Symposium, September 27, 2012 (Arizona State University)
Closing Technology Gaps for the Medical Electronics Industry, Jim McElroy (iNEMI), 2011 Medical Electronics Symposium: Vital Technologies for Health (sponsored by MEPTEC and SMTA), September 27, 2011 (Arizona State University, Tempe Arizona)

Miniaturization
 
Board Assisted BIST: Long and Short Term Solutions for Testpoint Erosion – Reaching into the DfX Toolbox, presented by Zoe Conroy (Cisco) to International Test Conference (ITC) (Anaheim, California; November 8, 2012)
iNEMI Pb-Free Alloy Characterization Papers at SMTA 2012 (as originally published in the 2012 SMTA International Conference Proceedings) (Orlando, Florida; October 17, 2012)
MEMS Packaging: Transforming the Challenges into Solutions, presented by Chuck Richardson, Director of Roadmapping (iNEMI) and Bill Bottoms (3MTS and iNEMI/ITRS & Packaging TWG Chair); webinar was hosted by MIG
iNEMI Study on Board Creep Corrosion, presented by Haley Fu (iNEMI) at the CEEDI (China Electronics Engineering Design Institute) Technical Seminar on Data Center IT Equipment Corrosion by Gaseous Contamination and Measures (Beijing, China; April 24, 2012).
Challenges to Increasing Wiring Density for Organic Packaging Substrates, presented by Masahiro Tsuriya (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 20, 2012)
iNEMI Experimental Investigation on Creep Corrosion, presented by Haley Fu (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 19, 2012)
iNEMI Investigations Focus on Copper Wire Bonding, presented by Haley Fu (iNEMI) at SMTA (April 25, 2012; Shanghai, China).
Current Industry Adoption of Fine-Pitch Cu Wire Bonding and Investigation Focus at iNEMI, presented by Grace O'Malley (iNEMI), at European Microelectronics Package Conference (EMPC), (September 2011; Brighton, England)
Technology Trends & Roadmaps for Package Innovation (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26, 2011; Cambridge, UK)
iNEMI Projects Addressing High-Complexity Packaging and Test Challenges (presented at Smart Systems Integration Conference; 3/23/11; Dresden, Germany)
Built-In Self-Test (BIST) Survey – An Industry Snapshot of HVM Component BIST Usage at Board and System Test, Zoë Conroy (Cisco), Hui Li and Jun Balangue (Agilent Technologies), IEMT Conference (November 30 – December 2, 2010; Melaka, Malaysia)
Report on iNEMI Boundary-Scan Adoption Project and Future Plans, Philip B. Geiger (Dell Inc.), Steve Butkovich (Cisco Systems Inc.), Haley Fu and Grace O’Malley (iNEMI), ESTC 2010 (Electronics Systems Integration Technology Conference) September 13-16, 2010, Berlin)
iNEMI Solder Paste Deposition Project Report‚ Laye Feng (Huawei Technologies), SMTA China South Technical Conference (August 31, 2010; Shenzhen, China).     paper (English)    presentation (Chinese)
Boundary-Scan Adoption – An Industry Snapshot with Emphasis on the Semiconductor Industry, Philip B. Geiger, Dell Inc., and Steve Butkovich, Cisco Systems Inc., International Test Conference (November 1-6, 2009; Austin, Texas).
iNEMI Solder Paste Deposition Project Report, Cherie Chen (IST), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21; Taipei, Taiwan)    paper     presentation

Optoelectronics
 
Presentations from iNEMI meeting at OFC/NFOEC 2013 (March 18, 2013; Anaheim, California).
Presentations from iNEMI meeting at OFC/NFOEC 2012 (March 5, 2012; Los Angeles, California).
Contamination Effects on Optical Performance for Short Reach 10Gb/s SFP+ Transceivers,” Fiber Connector End-Face Inspection Project team, Poster Session II, OFC/NFOEC (March 24, 2010; San Diego, California).
Contamination Effects on Lens-Based Optics Modules: Modeling and Experimental Analysis, Christine Chen (Avago Technologies), Yutaka Sadohara (Sumitomo Electric), Tatiana Berdinskikh (Celestica International Inc.), David Fisher (Tyco Electronics), Sun-Yuan Huang (Emcore Corp), Brian J. Roche and Beth Coviello (Cisco Systems Inc.), and Douglas H. Wilson (PVI Systems Inc.), poster session at OFC/NFOEC 2009, March 26 (San Diego, California).

Roadmap
 
Highlights from the iNEMI Thermal Management Technology Roadmap, presented by Grace O'Malley (iNEMI), at Eurotherm Seminar 102 - Thermal Management of Electronic Systems, University of Limerick (Limerick, Ireland; June 19, 2014)
iNEMI Roadmap and ITRS Plans for Collaboration Regarding “More Than Moore” Technology Beyond 2020, presented by Chuck Richardson, iNEMI; Paolo Gargini, ITRS, 225th ECS (Electro Chemical Society) Meeting (Orlando, Florida; May 12, 2014)
iNEMI Roadmap Activities In Emerging Technologies, presented by Chuck Richardson (iNEMI) (Orlando, Florida; October 15, 2012)
iNEMI Roadmap Issues In Emerging Technologies Panel Discussion (iNEMI members only file), presented by Chuck Richardson (iNEMI) (Orlando, Florida; October 15, 2012)
The iNEMI Roadmap – A Systems Approach to Closing Technology Gaps, presented by Jim McElroy (iNEMI) at the CMC Symposium (October 11, 2012; Toronto, Canada)
Highlights from iNEMI's Roadmap Activities, presented by Chuck Richardson (iNEMI) at ITRS Summer Meeting, (July 9, 2012; Monterey, California)
Highlights from iNEMI's Roadmap Activities, presented by Grace O'Malley (iNEMI) at ITRS More than Moore Workshop (April 25, 2012; Noordwijkerhout, The Netherlands)
2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission, presented by Chuck Richardson (iNEMI) at CARTS International (March 26, 2012; Las Vegas, Nevada)
iNEMI Roadmap Process & Industry Collaboration Projects to Close Roadmap Gaps, Bill Bader (iNEMI), presented at IMAPS Global Business Council (March 5, 2012; Scottsdale, Arizona)
Future Challenges for Electronics Manufacturing: Highlights from the iNEMI Technology Roadmap, Grace O’Malley (iNEMI), Zuken Engineering Day UK (ZEDUK) (November 2, 2011; Cosford, Shropshire, UK).
iNEMI Flexible Electronics Roadmap, Dan Gamota (Printovate), Workshop on Nanofabrication Technologies for Roll-to-Roll Processing (September 27, 2011; Boston Massachusetts)
KEYNOTE: Highlights of 2011 iNEMI Technology Roadmap, presented by Bill Bader (iNEMI), September 13, 2011, European Microelectronics Package Conference (EMPC), Brighton, England.
Technology Trends & Roadmaps for Package Innovation" (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26, 2011; Cambridge, UK)
“iNEMI Roadmap Highlights,” Chuck Richardson (iNEMI), SMTAI 2010 (October 27; Orlando, Florida)
“iNEMI Flexible Electronics Roadmap – From Concept to Product,” Daniel Gamota (Printovate), National Academies Symposium (September 24, 2010; Washington, D.C.)
"iNEMI Roadmap for Solid State Illumination‚" Haley Fu (iNEMI), ICEPT-HDP (August 18, 2010; Xi'an, China)   paper        presentation
“iNEMI Roadmap Highlights,” Haley Fu (iNEMI), SEIPI General Membership meeting (July 23, 2010; Baguio, Philippines)
Passives — The Road Ahead (highlights from the Passives Chapter of the 2009 iNEMI Roadmap), Grace O’Malley (iNEMI), Workshop on Passive Technology, TC40 meeting, Cambridge, UK, September 9, 2009.  
Closing Technology Knowledge Gaps — Projects Arising from the iNEMI Technology Roadmap, Bob Pfahl, Jim Arnold and Grace O'Malley (iNEMI), presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 18, 2009; Rimini, Italy)
iNEMI Roadmap Process for Communicating Requirements from OEMs to Suppliers, Grace O’Malley, 10th JIC (JISSO International Council) meeting, May 19, 2009 (held at LETI/Minatec in Grenoble, France).
2009 iNEMI Roadmap (keynote), Grace O’Malley (iNEMI), Astride the Packaging Roadmap Seminar, held at TWI Limited, April 22, 2009 (Cambridge, United Kingdom).
2009 iNEMI Roadmap Keynote and Chapter Discussions, NEPCON Shanghai/SMTA China East Technical Conference (April 21, 2009; Shanghai)
2009 iNEMI Technology Roadmap Forum, APEX 2009 (March 31; Las Vegas, Nevada)
The 2009 iNEMI Roadmap for Solid State Illumination (SSI), presented by Marc Chason (consultant), at the FlexTech Alliance’s 8th Annual Flexible Electronics & Displays Conference (Session 9: Solid State Lighting & Flexible OLEDs), February 4, 2009 (Phoenix, Arizona).