Advancing Manufacturing Technology

Presentations - iNEMI Substrate and Packaging Technology Workshop (members only)

Toyama, Japan
April 22-23, 2014
 
These presentations are available to workshop attendees and iNEMI members only, except as noted.  If you are an iNEMI member, please log into or create a web account to view.  If you attended the workshop and need access, please contact dtaylor@inemi.org.
 
Workshop Program, Abstracts and Speaker Biographies (available to public)
 
Bill Bader, iNEMI CEO
 
Rozalia Beica, Yole
 
Yasumitsu Orii, IBM Japan
 
Weifeng Liu, Flextronics
 
Kinya Ichikawa, Intel
 
John Wen, Huawei
 
Masateru Koide, Fujitsu
 
Bill Bottoms, 3MTS
 
Tim Lenihan, TechSearch
 
Toshihiko Nishio, STATS ChipPAC
 
Takashi Kariya, Ibiden
 
D.C. Hu, Unimicron
 
Shoji Watanabe, Shinko
 
Hikari Murai, Hitachi Chemical
 
Kazuaki Ano, Shinkawa
 
Haruo Shimamoto, SEMI 3DIC Co-Leader
 
Outcomes of the Breakout Groups (available to public)
Three Breakout Groups