Advancing Manufacturing Technology

iNEMI delivers keynote at NMI, Cambridge, UK, May 26, 2011

Grace O’Malley (iNEMI) delivered the keynote address at the NMI (National Microelectronics Institute) IC Packaging Innovation forum at TWI in Cambridge, UK, on May 26, “Technology Trends & Roadmaps for Package Innovation."  This presentation highlighted the findings of the Packaging and Component Substrates chapter of the 2011 iNEMI Roadmap.