PCB & Laminates TIG

New initiatives are currently being planned in this area. Among the potential projects being discussed are:
 

• Signal losses due to Cu foil surface treatment in high-frequency PCB designs
• Cost-effective assembly-level reliability testing of PCB constructions with dissimilar material for high-frequency applications (hybrid PCB)

Anyone interested in these potential initiatives should contact Steve Payne (steve.payne@inemi.org)

Active Projects 

• Mitigation of 5G Signal Loss Due to PCB Copper Foil Surface Treatments (in development)
• Potential New Initiatives

Completed Projects

• HFR-Free High-Reliability PCB
• Improving UL Certification of Laminates and PCBs