PCB & Laminates TIG
New initiatives are currently being planned in this area. Among the potential projects being discussed are:
- Signal losses due to Cu foil surface treatment in high-frequency PCB designs
- Cost-effective assembly-level reliability testing of PCB constructions with dissimilar material for high-frequency applications (hybrid PCB)
Anyone interested in these potential initiatives should contact Steve Payne (
steve.payne@inemi.org)
Active Projects
Completed Projects