Advancing Manufacturing Technology

PCB & Laminates TIG

New initiatives are currently being planned in this area. Among the potential projects being discussed are:
 

  • Signal losses due to Cu foil surface treatment in high-frequency PCB designs
  • Cost-effective assembly-level reliability testing of PCB constructions with dissimilar material for high-frequency applications (hybrid PCB)
Anyone interested in these potential initiatives should contact Steve Payne (steve.payne@inemi.org)

Active Projects 
Completed Projects