Feng Xue, IBM
Curtis Grosskopf, IBMPresentation Webinar
Webinar: Survey Results
The project team will review results of two industry surveys that assessed current methodologies and defined use conditions in order to identify potential gaps in common industry practices. Two sessions are scheduled; registration deadline is July 2. Additional details.
Session 1 – Asia Pacific
Tuesday, July 9
9:00 a.m. JST (Japan)
8:00 a.m. CST (China)
Session 2 - The Americas / EMEA
Tuesday, July 9, 2019
8:00 a.m. EDT (US)
2:00 p.m. CEST (Europe)
Statement of Work and Project Statement
- New package technologies are qualified using procedures and test conditions based on past experience with the most similar technology previously qualified.
- While previous experience is important to consider, it cannot be the only criterion.
- Relying too much on experience may result in overlooking new failure modes and/or new wear out mechanisms.
- Current test standards may not capture the reliability risk in the new package, or may overstress the technology in the new package.
- Lack of understanding of the assembly processes, application environments, and use conditions of all potential end-users (vs targeted end-users) poses challenges when developing the appropriate reliability test plan for new package/materials. For example:
- Test plan only focuses on standard test methodology or complies with the requirements of a few key customers.
- For new technologies field knowledge (failures, issues, etc.) cannot be fed back into the test plan.
- For new materials/package development, test plan completeness is always questionable.
- Proceeding quickly to device qualification in the new package may delay determination of root cause for technology issues for the new package.
- Little effort by industry to come out with a new test standard for new packaging technologies.
Purpose of Project
The purpose of this project is to develop a methodology for qualifying new packaging technology to address the gaps resulting from:
- Lack of understanding of assembly processes.
- Lack of understanding of the interactions of the materials and components within the new package.
- Lack of understanding of the application environment.
- Lack of understanding of the use conditions of all potential end-users.
- Lack of understanding how variations of the packaging and manufacturing process could affect product quality and reliability.
- Benchmarking of Qualification Methodologies for New Package Technologies and Materials
Presenter: Feng Xue (IBM Singapore)