Members
- Abbott
- Akrometrix, LLC
- Alpha Assembly Solutions, a MacDermid Performance Solutions Business
- Arizona State University
- ASM Pacific Technology
- Autodesk Inc.
- CALCE (Center for Advanced Life Cycle Engineering)
- CBA Group LLC
- Celestica, Inc.
- Center for Innovative Technology (CIT)
- Cimetrix
- Comet Group
- Compliance & Risks Ltd.
- CoreTech System Co., Ltd. (Moldex3D)
- Critical Materials Institute
- Dell, Inc.
- DfR Solutions
- Dow Electronic Materials
- Echo Environmental
- Electronic Components Industry Association (ECIA)
- Elmatica AS
- FiberQA LLC
- Flex
- Foresite, Inc.
- Fraunhofer IZM
- General Electric
- Georgia Institute of Technology
- Heraeus
- Hitachi Chemical Co., Ltd.
- Hover-Davis (CBA Group)
- HP, Inc.
- i3 Electronics, Inc.
- IBIDEN CO., LTD.
- IBM
- Idaho National Laboratory
- Indium Corporation
- Insidix
- Integrated Electronics Engineering Center (IEEC), SUNY-Binghamton
- Integrated Micro-Electronics Inc. (IMI)
- Intel Corporation
- Interflux Electronics N.V.
- IPC-Association Connecting Electronics Industries
- Isola Corp.
- IST-Integrated Service Technology, Inc.
- ITEQ Corporation
- ITI (Information Technology Industry Council)
- Juniper Networks
- Keysight Technologies, Inc.
- Korea Advanced Institute of Science & Technology (KAIST)
- Kulicke & Soffa Netherlands b.v.
- KYZEN Corporation
- Lenovo
- Lotes Co. Ltd.
- Massachusetts Institute of Technology (MIT)
- MED-EL Elektromedizinische Gerate GmbH
- MEMS & Sensors Industry Group
- Microsoft
- Momentum Technologies, Inc.
- Mycronic AB
- National Center for Manufacturing Sciences (NCMS)
- National Institute of Standards and Technology (NIST)
- Nihon Superior Co., Ltd.
- Nokia
- Oak Ridge National Laboratory
- OSA Industry Development Associates
- Pegatron Corporation
- pinfa (Phosphorus, Inorganic and Nitrogen Flame Retardants Association)
- Power Sources Manufacturers Association (PSMA)
- Purdue University
- Rochester Institute of Technology
- Safran
- Saki Corporation
- Sekisui Chemical Co., Ltd.
- Senko Advanced Components (Euro) Ltd.
- Senju Comtek Corp./Senju Metal Industry Co.
- Sheldahl (a Flex Company)
- Shengyi Technology Co., Ltd.
- Shenmao Technology Inc.
- Shinko Electric Industries Co., Ltd.
- STATS ChipPAC
- Suzhou Eunow Co. Ltd.
- SVXR Inc.
- TAKAOKA TOKO CO., LTD.
- Taiwan Printed Circuit Association (TPCA)
- Tamura Corporation
- Tin Products Manufacturing Co. Ltd. of YTCL
- U.S. Department of Defense (DoD)
- Universal Instruments (CBA Group)
- Urban Mining Company
- US Conec
- ViTrox
- Wistron Corporation
- Yxlon International GmbH (Comet Group)
- ZESTRON
