Start Date: 9/7/2018 8:30 AM CDT
End Date: 9/7/2018 12:30 PM CDT
Venue Name: Lenovo Nankang Office 8F Demo Center Location:
8F, No.66 San-Chong Road, Nankang District
Taipei, Taiwan 115
This half-day seminar is being hosted by Lenovo Taipei Design Center. It is scheduled for the last day of SEMICON Taiwan, but it is a separate event.
Date & Time
Friday, September 7, 2018
8:30 a.m. - 12:30 p.m. CST (China Standard Time)
Click here to register. Registration closes on August 30, but there is limited seating, so please register as soon as you can.
English & Chinese
If you can't join us in Taipei for this in-depth seminar, check out the webinars scheduled September 25-26.
Creep corrosion is the corrosion of metallization (generally copper and silver) and the migration of the corrosion product (typically copper and silver sulfides) across printed circuit board (FR-4 and solder mask) surfaces. In environments high in sulfur-bearing gaseous contamination, the extent of creep corrosion may be so high as to electrically short circuit adjacent pads and traces, causing the circuit boards to malfunction.
The restriction on the use of lead in solders in electronics occurred as the electronic market in Asia was expanding at a rapid rate. The combination of the poor creep corrosion resistance of the Pb-free PCB assemblies and the proliferation of electronics in the Asian geographies, which typically have high humidity as well as sulfur-bearing gaseous pollution, led to a dramatic rise in corrosion-based PCBA failure rates. Suddenly, there was a need for a corrosion test to ensure product survival in harsh sulfur-bearing environments. There was also a need to define gaseous contamination limits in which electronics could operate reliably. Various technical committees, including those of ASHRAE, IPC, ISA and iNEMI, became active in this arena.
iNEMI had an experimental program using mixed-flowing gases (MFG) test studying creep corrosion from 2009 to 2012. Then in 2013, iNEMI launched a development effort using flowers of sulfur (FoS) test for creep corrosion. The goal was to provide the industry a simple and proven test to qualify PCB/PCBA technologies. The iNEMI project has recently completed a white paper as well as a detailed project report (publication is pending) summarizing the test development work and recommending use of this FoS test set-up and procedure to test for creep corrosion or general corrosion.
Purpose of the Seminar
Who Should Attend
- Increase awareness, and understanding, of harsh environment challenges and corrosion-related failures
- Discuss the details of the FoS qualification test developed by iNEMI
- Encourage industry to develop corrosion resistant materials and technologies, and adopt corrosion test in development and qualification
- Data & telecom center users
- Equipment/device developers and makers
- Materials and PCB suppliers
- Researchers focusing on metal corrosion
Longsong Lin, Lenovo
||Creep Corrosion: Current Understanding of the Mechanisms and Accelerated Lab Testing Using Mixed Flowing Gas (MFG)
Dr. Chen Xu, Nokia
||iNEMI FoS Test Development & Test Procedure
Dr. Haley Fu, iNEMI
||Lenovo HPC & Hyperscale Data Center
Andrew Huang, Lenovo
||Mitigate Creep Corrosion in Hyperscale Data Centers
William Wu, Jason Jiang, Lenovo
||Introduction of Industry Standard Corrosion Tests Using FoS
Dem Lee, iST
||Effectiveness of the iNEMI FoS Test and Its Use for Mitigating Creep Corrosion
Dr. PJ Singh, IBM