Start Date: 9/26/2019 8:00 AM CDT
End Date: 9/26/2019 5:00 PM CDT
Venue Name: Stephens Convention Center Location:
5555 N River Rd
Rosemont, IL United States 60018
If you plan to be at SMTA International this year, be sure to check out the following papers/presentations from iNEMI project teams.
iNEMI members: make sure to join us for the members meeting on Tuesday, September 24, 4:00-6:00 p.m.
Thursday, September 26
LF 1 Lead-Free Reliability Challenges
Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys
Presented by Richard Coyle, Nokia Bell Labs
MFX 7 Cleaning Challenges
10:30 a.m. — 12:00 p.m.
Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies – iNEMI Cleanliness Research Study
Presented by Mike Bixenman, KYZEN Corporation
LF 3 Low Temperature Solder
iNEMI Project on Process Development of BISN-Based Low Temperature Solder Pastes - PART VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components
Presented by Raiyo Aspandiar, Intel Corporation