Advancing Manufacturing Technology

Event Calendar

Wednesday, September 23, 2020

Packaging TIG Technical Sharing on Embedded Component Packaging Technology (members only)

Start Date: 9/23/2020 9:00 AM EDT
End Date: 9/23/2020 10:00 AM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

Packaging TIG Technical Sharing on Embedded Component Packaging Technology
Wednesday September 23, 2020
10:00-11:00 p.m. JST (Japan)
3:00-4:00 p.m. CEST (Europe)
9:00-10:00 a.m. EDT (Americas)
Get meeting login information (requires member log-in)

The Packaging Technology Integration Group (TIG) has discussed several potential iNEMI initiatives and one is embedded component packaging technology. Embedded active and passive components in substrates is a key technology for advanced packaging, such as SIP. Markus Leitgeb from AT&S will present an overview of embedded components packaging technology and challenges, and identify potential collaborations.