Advancing Manufacturing Technology

Event Calendar

Wednesday, September 5, 2018

iNEMI Presentations at IEMT Conference

Start Date: 9/5/2018 4:00 PM CDT
End Date: 9/5/2018 5:45 PM CDT

Location:
Malaysia 

38th International Electronics Manufacturing Technology (IEMT) Conference 2018
September 4-6, 2018
Venue:  Ramada Plaza Melaka, Malaysia

iNEMI Session D2
September 5, 2018
4:00-5:40 p.m. MYT (Malaysia Time)
Room:  Bunga Melati

A special track of iNEMI will be held as Session D2.  Four iNEMI projects will be presented to communicate the project outcomes.

  • Benchmarking on New Packaging Technology Qualification Methodology and Practices, Feng Xue (IBM)
  • Modeling of Molded Electronic Package Warpage Characteristic with Cure Induced Shrinkage and Viscoelasticity Properties, Wei Keat Loh (Intel)
  • Mitigating Creep Corrosion with Effective Test, Haley Fu (iNEMI)
  • Characterize and Quantify the Production Inspection Capability of AXI for HiP Defects, Jeremy Pemberton-Pigott (Keysight)
To review the conference program and register for the conference, please go to https://ieee-epsmalaysia.org/iemt/.