Advancing Manufacturing Technology

Event Calendar

Friday, July 3, 2020

Warpage Characterization and Management Program Call-for-Participation, Session 2 (APAC)

Start Date: 7/3/2020 9:00 AM CDT
End Date: 7/3/2020 10:00 AM CDT

Location:
United States 

Session 2 (APAC)
Friday, July 3, 2020
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PDT (Americas) on July 2
Register for this webinar

Session 1 (Americas & EMEA)
Wednesday, June 24, 2020
9:00-10:00 a.m. EDT (Americas) 
3:00-4:00 p.m. CEST (Europe)
9:00-10:00 p.m. CST (China)
Register for this webinar

For additional information, contact Haley Fu (haley.fu@inemi.org)

Warpage Characterization and Management Program

The Warpage Characteristics of Organic Packages project has completed four phases addressing metrology challenges, the recent trends of package warpage characteristics, as well as gaps in warpage simulation. With the evolution of the project scope, this series of iNEMI projects has been combined in the Warpage Characterization and Management Program, as an umbrella for all warpage related projects. This new program includes two projects currently in sign-up: 

1) Package Warpage Prediction and Characterization Project 
Dynamic warpage characterization of electronic packages is critical for high yielding board assembly. One of the challenges is to predict the dynamic warpage behavior of the new packages accurately enough through simulation before having the real physical article. Current package warpage modeling capabilities are not adequate to satisfy this need. This project has two major scopes: 

  • Warpage characterization for the latest advanced packaging technologies from real samples to track the typical warpage ranges and trends.
  • Package warpage prediction – Based on the modeling framework gap analysis and simulation case study in earlier iNEMI warpage project work the team plans to further investigate organic substrate-based packages. They will conduct material properties characterization, including that of the mold compound and substrate raw material, to help understand the impact of curing process on eventual package warpage.  
 
2) High Density Interconnect Socket Warpage Prediction and Characterization Project
High speed, solder array-based socket connectors are complex components. Any warpage across the socket contributes to yield and quality challenges during the SMT processes, plus it impacts performance and rework. This project will investigate the warpage of high-density large size array sockets and the impact of socket design and fabrication process on warpage.  In particular, the project aims to 
  • Develop socket warpage measurement metrology and prediction methods
  • Determine the impact of molding and design on large size socket warpage