Advancing Manufacturing Technology

Event Calendar

Tuesday, July 9, 2019

Survey Results Webinar: New Package Technology Qualification Methodology

Start Date: 7/9/2019 8:00 AM EDT
End Date: 7/9/2019 9:00 AM EDT

Location:
United States 


Session 1 – Asia Pacific 
Tuesday, July 9
9:00 a.m. JST (Japan)
8:00 a.m. CST (China)
Registration
 
Session 2 - The Americas / EMEA
Tuesday, July 9, 2019
8:00 a.m. EDT (US)
2:00 p.m. CEST (Europe)
Registration

Background
iNEMI’s New Package Technology Qualification Methodology project is evaluating qualification methods currently used by the electronics manufacturing industry and assessing whether those methods can be improved. Typically, new package technologies are qualified using procedures and test conditions based on standard tests or experience with the most similar technology previously qualified. While previous experience is important to consider, it cannot be the only criterion. Relying too much on experience may result in overlooking new failure modes and/or new wear out mechanisms. Current test standards may not capture the reliability risk in the new package or may overstress the technology in the new package. On the other hand, lack of understanding of the assembly processes, application environments, and use conditions of all potential end-users (vs targeted end-users) poses challenges when developing the appropriate reliability test plan for new packages and materials. With shorter development cycle time and more frequent introduction of new packaging technologies, a thorough qualification methodology is necessary to identify potential issues and ensure adequate reliability.

Industry Surveys
The New Package Technology Qualification Methodology project team conducted two industry surveys to assess the current methodologies and identify potential gaps in common industrial practices for new package and material technology qualification. The first survey was conducted in the fourth quarter of 2018 and the follow-up survey was completed in the first quarter of 2019. Individuals from the entire electronic supply chain were invited to participate in the survey, and feedback was received from device users, device suppliers, fabless device suppliers, design houses, packaging suppliers (OSAT), and fab suppliers. The survey covered topics such as new packaging materials, new packaging technologies, end-user concerns, test conditions, new application spaces, and new qualification requirements. Analysis of the feedback and findings from the surveys has informed the team and they will use this information to develop recommendations for the industry and standard bodies for a standard methodology for the development and qualification of new packaging technologies and materials.
 
Survey Results
The project team will present a summary of the key findings from the surveys and outline the recommendations and report being prepared about the gaps identified in the industry’s methodology for qualifying new packaging technology. They will also identify how these gaps should be addressed to ensure more reliable qualification of packaging technologies.
 
Two webinars are scheduled to review survey results. The webinars are free, but advance registration is required for organizational purposes. Once you register, you will receive a confirmation email with instructions for joining the meeting. Registration deadline is July 2.

Project Leaders
Curtis Grosskopf and Feng Xue, IBM
 
For Further Information
Masahiro Tsuriya