Advancing Manufacturing Technology

Event Calendar

Thursday, May 21, 2020

iNEMI Roadmap Highlights Series: Board Assembly, Session 2 (APAC)

Start Date: 5/21/2020 8:00 AM CDT
End Date: 5/21/2020 9:00 AM CDT

Location:
United States 

Organization Name: iNEMI

Contact:
Linda Wilson
Email: linda.wilson@inemi.org
Phone: (984) 333-0820

Presenter: Jasbir Bath, Bath Consultancy

Board assembly is a critical part of the overall electronic products supply chain. It is strongly associated with component packaging, interconnection, inspection, thermal management, final assembly, and environmental compliance. The webinar focuses on drivers and critical gaps and challenges for 1) assembly materials-- continuous lead-free solder alternatives and development as well as the trends including conformal coatings; 2) press-fit -— trends in press-fit pin connectors, key attributes and prioritized research and development, and 3) repair and rework trends for hand-soldering, plated through hole (PTH), area array and non-standard component rework.

Board Assembly, Session 1 (Americas/EMEA)
Wednesday, May 20

11:00 a.m. EDT (Americas)
5:00 p.m. CEST (Europe)

Register for this webinar

Board Assembly, Session 2 (APAC)
Thursday, May 21
8:00 a.m. CST (China)
5:00 p.m. PDT (Americas) on Wednesday, May 20
Register for this webinar

 

Upcoming Webinars

See a schedule of all roadmap webinars