Advancing Manufacturing Technology

Event Calendar

Wednesday, May 20, 2020

iNEMI Roadmap Highlights Series: Board Assembly, Session 1 (Americas/EMEA)

Start Date: 5/20/2020 11:00 AM EDT
End Date: 5/20/2020 12:00 PM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Linda Wilson
Email: linda.wilson@inemi.org
Phone: (984) 333-0820

Presenter: Jasbir Bath, Bath Consultancy

Board assembly is a critical part of the overall electronic products supply chain. It is strongly associated with component packaging, interconnection, inspection, thermal management, final assembly, and environmental compliance. The webinar focuses on drivers and critical gaps and challenges for 1) assembly materials-- continuous lead-free solder alternatives and development as well as the trends including conformal coatings; 2) press-fit — trends in press-fit pin connectors, key attributes and prioritized research and development, and 3) repair and rework trends for hand-soldering, plated through hole (PTH), area array and non-standard component rework.

Board Assembly, Session 1 (Americas/EMEA)
Speakers: Jasbir Bath
Wednesday, May 20, 2020
11:00 a.m. EDT (Americas)
5:00 p.m. CEST (Europe)
Register for this webinar

Board Assembly, Session 2 (APAC)
Thursday, May 21, 2020 
8:00 a.m. CST (China)
5:00 p.m. PDT (Americas) on Wednesday, May 20
Register for this webinar


Upcoming Webinars

 See a complete schedule of roadmap webinars.