Start Date: 5/13/2021 10:10 AM EDT
End Date: 5/13/2020 11:50 AM EDT
Location:
United States
ICEP 2021 (virtual event)
May 12-14, 2021
iNEMI will host a technical session at the International Conference on Electronics Packaging (ICEP). This invited session features presentations by several iNEMI project teams. In addition, an iNEMI presentation is include in the on-demand sessions.
TA1: iNEMI Invited Session
Thursday, May 13
10:10-11:50 a.m.
TA1-1: 5G Standard Reference Materials
Presenter: Nathan Orloff (NIST)
TA1-2: Predictive Modelling Methodologies for Bi-Material Wafer Warpage
Presenter: Kang Eu On (Intel)
TA1-3: Micro Voids Inspection Capability Study in First Level Interconnections for Flip Chip Packages
Presenter: Kor Oon Lee (Intel)
TA1-4: Low Temperature 1st Level Interconnect in Packaging and Its Challenges
Presenter: Sze Pei Lim (Indium)
On Demand Session
- OD-49: Post Mechanical Shock Test Failure Analysis on Mixed SnAgCu-BiSn BGA Solder Joints
Presenter: Raiyo Aspandiar (Intel)
