Advancing Manufacturing Technology

Event Calendar

Wednesday, May 13, 2020

PCB Warpage Characterization and Minimization End-of-Project Webinar

Start Date: 5/13/2020 11:00 AM EDT
End Date: 5/13/2020 12:00 PM EDT

Location:
China 

Organization Name: iNEMI

Contact:
Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

Session 1, for APAC and EMEA
Topic: iNEMI PCB Warpage Characterization and Minimization EoP Webinar Session 1
Date: Wednesday, May 13, 2020
Time: 11:00-12
:00 pm, US EDT
Register for webinar

 
Session 2, for NA & APAC
Topic: iNEMI PCB Warpage Characterization and Minimization EoP Webinar Session 2
Date: Wednesday, May 13, 2020
Time: 9:00-10
:00 pm, US EDT
9:00-10:00 am, Thursday, May 14, 2020 China Time
Register for webinar

 
The use of thinner components and thinner multi-up panel PCBs (≤ 40 mils) has led to PCB warpage issues in SMT assembly process, which in turn impacts the PCB assembly yield. Study needs to be done in order to gain a better understanding on the key PCB manufacturing factors that impact PCB warpage. This project conducted experiment with a 10-layer PCB test vehicle design using two different PCB suppliers. The experimental factors included PCB post processing (bake & no bake PCB), panel locations (corner & center), PCB thicknesses (0.8 mm & 0.6 mm), Material (Mid Tg & High Tg), and PCB processing (lamination process at PCB vendor A vs. B). The PCB warpage was evaluated using high temperature measurement warpage metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. Data analysis results and findings will be reported at the webinar.
More background information about this project can be found at https://community.inemi.org/pcb_warpage_char