Advancing Manufacturing Technology

Event Calendar

Wednesday, April 24, 2019

Low-Temperature Solder Workshop - SMTA China

Start Date: 4/24/2019 9:45 AM CDT
End Date: 4/24/2019 5:15 PM CDT

Venue Name: Shanghai World Expo Exhibition & Convention Center

Location:
1099 Guozhan Rd, Pudong Xinqu
Shanghai Shi, China 

Organization Name: iNEMI

Contact:
Kristin Christensen
Email: kchristensen@inemi.org
Phone: 9843330820

Held at 2019 SMTA China East Technology Conference (in conjunction with NEPCON China 2019)
Meeting room #9
 
Organized by: iNEMI
Co-organizer: SMTA China, Reed Exhibition 

Registration
$120 USD / ¥900 CNY
(Fee is waived for invited speakers.)

Registration is due April 18; onsite registration will not be available.

Registration fee covers workshop presentations, lunch coupon, and refreshments.

NOTE: Registration payments can be made in U.S. dollars via credit card, or in Chinese Yuan (CNY)  by wire transfer. (The amount charged for wire transfer registration includes tax and service charge, and an invoice will be provided.) If you need a Chinese formal invoice, please download the registration form and make CNY wire transfer.
 
To register by credit card, click on the appropriate registration button above. 

Click here for wire transfer instructions and form.

Background

The use of low-temperature solder assembly, with peak reflow temperatures below the current 240oC+ level for SnAgCu (SAC), has the opportunity to offer economic, environmental and technical benefits. 

It also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages used in emerging applications such as ultra-mobile computing, wearable devices and Internet of Things (IoT). In addition, lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields. These are all attractive benefits, though achievement requires a new class of reliable soldering materials and processes. 


Purpose of the Workshop
This workshop will provide an interactive forum where participants can discuss and share information about such topics as:
  • New developments and future plans for low-temperature solder materials and techniques
  • Results from iNEMI’s BiSn-Based Low-Temperature Soldering Process and Reliability project
  • Innovations required to improve yield and quality
  • Impact of future product and technology requirements on solder materials and processes
  • Processability, reliability and failure mechanism of low-temperature solder materials
  • Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry
Agenda 
 
9:30 – 9:45   Sign for workshop attendance
9:45 – 10:00   “Welcome and Workshop Overview”, Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
10:00 – 10:30   “Surface Mount Technology Using Low Temperature Soldering”, Kok Kwan Tang, CPTD Technical Program Manager, Intel
10:30 – 10:55   “Low Temperature Solder Alloy System in Electronic Packaging”, Dr. Jun Shen, Professor, PhD Advisor, Chongqing University
10:55 – 11:20   “iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability Project Report”, Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
11:20 – 11:45   “Low Temperature Solder Overview”, Jacky Zhang, Global Supplier Quality Manager, Dell
11:45 – 13:00   Lunch
13:00 – 13:25   “Development of Low Temperature Solder for Next Generation SMT”, Naoki Kubota, Technical Sales Specialist, Tamura
13:25 – 13:50   “Low Temperature Solder for SMT”, Domini Zhang, Operations Engineering Manager, Flex
13:50 - 14:05   Tea break
14:05 – 14:30   “Advanced Low Temp Lead-free Solder for SMT Assembly”, Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology
14:30 – 14:55    “High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies”, Annie Yang, Regional Marketing Manager – China, MacDermid Alpha
14:55 – 15:20   “Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges”, Dr. Panju Shang, Senior Engineer, Huawei
15:20 - 15:30   Tea break
15:30 – 15:55   “Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint Evaluation", Qin Chen, R&D Manager, Eunow
15:55 – 16:20   “High Speed Shear Results of Low Temperature Solder”, Dr. Xin Wang, SMT Lab Associate Manager, Quanta
16:20 – 17:00   Panel discussion
17:00 – 17:15   Wrap up

Online Registration

Registration is Closed
Closed: 4/24/2019 2:00 PM

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