Advancing Manufacturing Technology

Event Calendar

Thursday, April 23, 2020

iNEMI Technical Session at ICEP

Start Date: 4/23/2020 10:10 AM JST
End Date: 4/23/2020 11:50 AM JST

Venue Name: Room A

Location:
Japan 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

International Conference on Electronics Packaging (ICEP 2020)
April 22-25; Tokyo 
 
TA1: iNEMI Session
TA1-1
Industry 4.0 Adoption: AJourney in Smart Supply Chain and Manufacturing Transformation
Feng Xue2,1, 1iNEMI / Japan, 2IBM / Singapore

TA1-2
An Analysis of Packaging Technologies for Heterogeneous Integration - Challenges and Recommendations
Masahiro Tsuriya1, Wei Keat Loh2, Sze Pei Lim3, Noritaka Katagiri4, Kiyoshi Oi4, Ming-Che Hsieh5, Haruo Shimamoto6, Kenichi Ikeda7, Nate Brese8, 1iNEMI / Japan, 2Intel Technologies / Malaysia, 3Indium / Singapore, 4Shinko Electric Industries / Japan, 5JCET STATSChipPAC / Singapore, 6AIST, 7Hitachi Chemical / Japan, 8DuPont Electronics & Imaging / USA

TA1-3
The Past, Present and Future of Package Warpage Management
Wei Keat Loh1, Chih Chung Hsu3, Ron W Kulterman2, Haley Fu4, Kang Eu Ong1, Jennan Wang3, 1Intel Technologies / Malaysia, 2Flex / USA, 3Moldex3D / Taiwan, 4iNEMI / China

TA1-4
Experimental and Numerical Study of Panel Level Packaging Flowability and Warpage
Renn Chan Ooi1, Tanja Braun2, Marc Dreissigacker3, Sejin Han4, Franco S Costa5, Goran Liu6, Diane Ecoiffier7, Haley Fu8, Hideki Misawa9, Akihiko Osaki9, 1Intel / Malaysia, 2IZM Fraunhofer, 3Technical Univ. Berlin / Germany, 4Autodesk / USA, 5Autodesk / Australia, 6CoreTech System / Taiwan, 7Insidix / France, 8iNEMI / China, 9Shin-Etsu Chemical / Japan