Advancing Manufacturing Technology

Event Calendar

Thursday, April 19, 2018

iNEMI Session at ICEP-IAAC 2018

Start Date: 4/19/2018 4:00 PM JST
End Date: 4/19/2018 5:45 PM JST

Venue Name: Hotel Hanamizuki

Mie, Japan 

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

iNEMI Session

Thursday, April 19, 2018

This session on Thursday afternoon includes presentations based on four iNEMI projects:
  • SiP Module Mold Flowability Experiment Result and Simulation Study
  • SiP Module Warpage Characterization and Simulation Study
  • iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes, Part III: Mechanical Shock Tests on PoP BGA Assemblies
  • iNEMI Project Overview: Characterize and Quantify the Production Inspection Capability of AXI for HiP Defects
 Additional conference information