Start Date: 4/11/2019 9:00 AM EDT
End Date: 4/11/2019 10:30 AM EDT
Topic: Interim report for QFN Package Board Level Reliability Project
Host: Grace O'Malley
Date: Thursday, April 11, 2019
9:00 a.m. Eastern Daylight Time (North America)
3:00 p.m. EST (Central Europe)
This webinar is open to iNEMI members only.
The deployment of QFN packages has grown significantly in recent years across the industry. This package format has advantages such as minimizing board real estate usage, excellent thermal management characteristics, potentially better electrical performance, and lower cost than competitive packaging. While this low form factor was initially developed for hand-held consumer electronic devices, in recent years use of QFN packages has expanded into telecom and automotive applications, where long-term board level reliability requirements for thermal fatigue resistance are more demanding than in consumer applications.
The lack of thermal cycling data for characterizing these longer product lifetimes in more aggressive use environments, and the absence of data to assist the development of predictive modelling capabilities were the drivers for the Board Level Reliability project’s focus on QFN packages. The team will be reporting on the assembly and reliability testing to date of different package constructions on varying board thicknesses. There will also be discussion about the future work necessary to enhance the understanding of the board level reliability for these package types.
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For additional information, contact: Grace O'Malley, iNEMI (email@example.com)