Start Date: 4/22/2020 11:00 AM EDT
End Date: 4/22/2020 12:00 PM EDT
Location:
United States
Organization Name:
iNEMI
Contact:
Presenters: Steve Payne (iNEMI) & Ed Kelley (Isola)
iNEMI is hosting a series of webinars highlighting information from our 2019 Roadmap. Leaders from the working groups who developed select chapters will present relevant market trends, key applications and other influences that are driving developments, plus current and future gaps that are impacting the industry.
The Organic PCB chapter summarizes the technology needs for all forms of printed circuit boards and flexible circuits. This webinar will discuss the growing complexity of components that drive the need for multilayer PCB constructions. The continuing trends for higher speed processors, coupled with technologies such as 5G communications, will be highlighted as these require specialized materials, in particular base laminates, as well as new fabrication techniques, such as mSAP. Considerations for a dense packaging of electronics, including embedding passive and active components, are covered as well as optical PCB challenges. Advanced technologies used for organic semiconductor packaging substrates will also be included as their technologies are now being adapted for advanced high-density interconnect (HDI) PCBs.
This webinar is open to anyone; advanced registration is required.
Organic PCB Roadmap
Wednesday, April 22, 2020
11:00 a.m. EDT (Americas)
5:00 p.m. CEST (EMEA)
Register for this webinar
Friday, April 24, 2020
8:00 a.m. CST (APAC)
8:00 p.m. EDT on Thursday, April 23 (Americas)
Register for this webinar
Upcoming Webinars