Advancing Manufacturing Technology

Event Calendar

Wednesday, April 17, 2019

iNEMI Session at ICEP 2019

Start Date: 4/17/2019 4:40 PM JST
End Date: 4/17/2019 6:20 PM JST

Venue Name: Toki Messe, Niigata Japan

Location:
Japan 

iNEMI session: WA1
Date: April 17
Place: Room A
Time: 16:40 – 18:20
 
Be sure to join us at the iNEMI at the International Conference on Electronics Packaging (ICEP) in Japan (April 17-20, 2019).  This session will feature four presentations that discuss results from iNEMI projects and the 2019 iNEMI Roadmap. 

Program:

  • Packaging Technology Roadmap and Electronics Manufacturing Challenges and Opportunities
    • Presenter: Marc Benowitz/ iNEMI
  • Benchmarking of Qualification Methodologies for New Package Technologies and Materials
    • Presenter: Feng Xue/ IBM
  • Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages
    • Presenter: Masahiro Tsuriya/ iNEMI
  • Molded Electronic Package Warpage Predictive Modelling Methodologies
    • Presenter: Wei Keat Loh/ Intel