Start Date: 3/3/2021 8:00 AM EST
End Date: 3/3/2021 9:00 AM EST
Location:
Japan
Organization Name:
iNEMI
Contact:
Call for Participation: RDL Adhesion Strength Measurement Project
Session 2
Wednesday, March 3, 2021
8:00 a.m. EST (Americas)
2:00 p.m. CST (EMEA)
10:00 p.m. JST (Japan)
Registration coming soon
Session 1
Tuesday, March 2, 2021
8:00 p.m. EST (Americas)
2:00 a.m. CST (EMEA) on Wednesday, March 3
10:00 a.m. JST (Japan) on Wednesday, March 3
Registration coming soon
RDL (Redistributed Layer) adhesion for advanced Substrate, FO-WLP and PLP is critical for packaging lifetime quality, and poor adhesion strength can lead to circuit patterning quality and package reliability issues. RDL is exposed to the manufacturing process environment, which may cause degradation in the adhesion to other materials, such as the encapsulant, insulation, die, carrier wafer, substrate, panel, etc.
There is no global standard available to measure narrow RDL adhesion strength. The only available measurement standard by IPC is for wider Cu trace adhesion to printed circuit boards. It is critical for the industry to have a means to identify potential quality risks due to insufficient adhesion strength.
?The objective of the RDL Adhesion Strength Measurement project is to evaluate the adhesion strength measurement methodologies and characterize the RDL mechanical performances and to establish the potential common requirements for key material properties so that packaging companies and users have identical qualification requirements.
The approach of this project is:
- Phase 1: evaluate the applicable adhesion strength measurement methodologies, validate the selected methodologies and develop the experimental guidelines.
- Phase 2: apply the defined methodology to characterize RDL adhesion for several material sets and conditions. This may include accelerated stress testing of the test coupon or test vehicle to assess relationship between adhesion and package reliability.
This webinar will explain the motivation and scope with task plan will be explained to seek for the participants to the project.
This project plans to start in late March 2021.
