Start Date: 3/24/2021 9:00 AM EDT
End Date: 3/24/2021 10:00 AM EDT
Location:
United States
Organization Name:
iNEMI
Contact:
Wednesday, March 24, 2021
9:00-10:00 a.m. EDT (Americas)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Register now
Presenter: Dr. Endo
Toray Research Center
Analytical technology is critical for determining joint quality and interconnection layers in heterogeneous integrated packages. Dr. Endo from Toray Research Center will present analytical and evaluation technologies for joint reliability and interconnection layers. He will introduce material property analysis methods and several examples of analysis results using material property analysis and morphological analysis (3D-SEM and EBSD).
