Start Date: 7/15/2021 11:00 AM EDT
End Date: 7/15/2021 12:00 PM EDT
NC United States
11:00 a.m.—12:00 p.m. EDT (Americas)
5:00—6:00 p.m. CEST (Europe)
11:00-12:00 p.m. CST (China)
Speaker: Aric Shorey (Mosaic Microsystems)
Thin glass substrates with fine-pitch through-glass via (TGV) technology provides attractive solutions for 5G, wafer level packaging and systems integration. Electrical and physical properties of glass have many attractive attributes such as low RF loss, the ability to adjust thermal expansion properties, low roughness with excellent flatness to achieve fine L/S. The biggest challenge to adopting glass as a packaging substrate has been the existence of gaps in the supply chain, caused primarily by the difficulty in handling large, thin glass substrates using standard automation and processing equipment. The Viaffirm™ temporary bonding technology allows the thin glass substrates to be processed leveraging typical processing technology without the need to modify existing equipment. The webinar will talk about this enabling technology as well as examples where glass-based devices provide low loss, high-Q solutions for 5G filters, low loss/high gain antenna for mm-Wave as well as hermetic packaging for MEMS and sensors.