Advancing Manufacturing Technology

Event Calendar

Wednesday, May 26, 2021

Packaging Tech Topic Series: Integrated Passive Component Technologies for Advanced Packaging

Start Date: 5/26/2021 9:00 AM EDT
End Date: 5/26/2021 10:00 AM EDT

Organization Name: iNEMI

Masahiro Tsuriya
Phone: (198) 433-3082 x0

May 26, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)

NOTE: this is a members-only event. Click the "Member Registration" button (above on the right). You will need to be logged in to register. If you do not have an iNEMI web account, you can set one up now. If you have any problems, email Cynthia Williams (

Kazuma Noguchi (Murata Manufacturing Co., Ltd) will present the latest market and technology trends for integrated passive component technologies, focusing on multi-layer ceramic capacitors (MLCCs) and their applications. (MLCCs are packaging components that enable system-in-package.) His presentation will also cover layer thinning technology, chip surface flatting technology and various mounting technologies. 

For additional information, contact Masahiro Tsuriya