Start Date: 4/14/2021 3:00 PM EDT
End Date: 4/14/2021 5:45 PM EDT
Location:
United States
International Conference on Device Packaging
(virtual event)
Sponsored by the International Microelectronics Assembly & Packaging Society (iMAPS)
April 12-15, 2021
iNEMI Invited Session on 5G Electronics Challenges: High Frequency Materials Characterization
Wednesday, April 14 / 3:00-5:45 p.m. EDT (Americas)
This session is chaired by Urmi Ray (iNEMI) and features five presentations reporting on the status of iNEMI’s 5G/mmWave Materials Assessment and Characterization project. It will be live on Wednesday, April 14, 3:00-5:45 p.m. EDT (Americas) and on-demand in the content library through May 14.
3:00-3:30
Challenges for High Dk/Df Measurements
Urmi Ray (iNEMI)
3:30-4:00
Benchmarking Resonator Based Low Dk/Df Material Measurements
Richard Stephenson (EMD Electronics)
4:00-4:30
Recent Developments of Resonator Measurements for Emerging Materials and Technologies
Malgorzata Celuch & Marzena Olszewska-Placha (QWED)
4:45pm - 5:15pm
High Frequency Measurements Using Wafer Level Techniques
Nathan Orloff (NIST)
5:15pm - 5:45pm
Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements
Say Phommakesone (Keysight Technologies)
In addition to the iNEMI session that Urmi is moderating, she is also:
- Teaching a real-time instructional Professional Development Course (A4: 5G mmWave Package Development Requirements and Solutions; Monday, April 12, 4:00-6:00 p.m. EDT)
- Moderator for the live, industry-sponsored panel, 5G Materials Roadmap: Industry Voices (Thursday, April 15, 1:00-2:00 p.m. Eastern).
