Start Date: 2/24/2021 10:00 PM JST
End Date: 2/24/2021 11:00 PM JST
Packaging TIG Technical Sharing Session: Cu-Cu Bonding Technology
Wednesday, February 24, 2021
8:00 a.m. EST (Americas)
2:00 p.m. CST (EMEA)
10:00 p.m. JST (Japan)
Registration coming soon
Direct Cu bonding is touted as a promising solution for ultra-fine pitch connections below 10 µm. The benefits include better scalability, performance and reliability. In this webinar, Dr. Tan will provide an historical perspective, discuss the current state of development as well as use cases and highlight recent progress in Cu hybrid bonding. The technical and reliability challenges will also be discussed. The talk will end with a critical assessment of, and outlook for, this promising technology.
About the Speaker
Chuan Seng Tan, PhD
Nanyang Technological University, Singapore
Chuan Seng Tan is a Professor of Electronic Engineering at the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore. Currently, he is working on process technology of three-dimensional integrated circuits (3D ICs), as well as engineered substrate (Si/Ge/Sn) for group-IV photonics. He has IPs on 3D technology and engineered substrates, and nine of his inventions have been licensed to a spin-off company. He also has numerous publications (journals and conferences) and has co-edited/co-authored five books on 3D packaging technology.
Dr. Tan received his PhD from MIT in 2006. He is a senior member of IEEE and a recipient of the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) in 2019. Beginning June 2019, he is a Distinguished Lecturer with IEEE-EPS. He is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) since 2019 and a recipient of the William D. Ashman - John A. Wagnon Technical Achievement Award in 2020.