Advancing Manufacturing Technology

Event Calendar

Wednesday, December 4, 2019

EPTC Session: Packaging Challenges & Opportunities for 5G Applications

Start Date: 12/4/2019 4:15 PM JST
End Date: 12/4/2019 6:15 PM JST

Location:
Singapore 

Organization Name: iNEMI

Contact:
Haley Fu
Email: haley.fu@inemi.org
Phone: 86-186-165-338-91



iNEMI is organizing a panel session on packaging material challenges and opportunities for 5G applications as part of the IEEE’s Electronics Packaging Technology Conference (EPTC) 2019. The move to 5G is driving changes and developments in the electronics manufacturing industry, particularly in areas such as materials, design, and testing. The session features a panel of industry leaders who will identify key challenges from their perspectives of the supply chain, followed by an in-depth Q&A session with the audience. Download panelist bios.

Speakers include:

  • Dr. Seung Wook Yoon
    Corporate Vice President / Package Technology Planning, Test & System Package
    Samsung Electronics
  • Dr. Toshihisa Nonaka
    Technical Director of Packaging Solution Center
    Hitachi Chemical Co., Ltd.
  • Professor Y. P. Zhang
    Professor, School of Electrical and Electronic Engineering
    Nanyang Technological University, Singapore
  • Mr. Shunichi Kikuchi
    Corporate Vice President
    Fujitsu Advanced Technologies Limited
  • Erkko Helminen
    Senior Manager, Advanced Development - Corporate Technology
    TTM Technologies
  • Dr. Gokul Kumar
    Senior Manager, Packaging Design and Development
    Micron