Advancing Manufacturing Technology

Event Calendar

Wednesday, October 23, 2019

iNEMI Session at IMPACT

Start Date: 10/23/2019 3:30 PM JST
End Date: 10/23/2019 5:45 PM JST

Venue Name: 5F Taipei Nangang Exhibition Center

Location:
No.1, Jingmao 2nd Rd., Nangang District,
Taipei, Taiwan  11568

Plan to join iNEMI at the International Microsystems, Packaging, Assembly and Circuit conference (October 23-25; Taipei, Taiwan). We are a co-organizer of this event and are organizing a session on Wednesday, October 23, focusing on modeling and simulation in electronics packaging. Speakers from Intel, CoreTech, Zuken and Mentor will discuss development trends, needs, and gaps of electronics design and simulation in today’s environment of fast-developing packages with advanced and heterogeneously integrated architecture, materials and processes. This session is intended to help generate ideas for industry collaboration on co-design. In addition to this session, CEO Marc Benowitz will deliver a keynote address - Electronics Manufacturing Challenges and Opportunities: Closing the Gaps via Collaborative Innovation- as part of the opening ceremony on Wednesday, October 23.

Preliminary agenda:

  • Session overview (5 minutes), Dr. Haley Fu, iNEMI
  • 4 presentations (25 minutes each, including 1-2 questions)
  1. The Need of Multi-physics Simulation Capabilities to Enable Electronic Packaging of the Future, Dr. Wei Keat Loh, Intel Corporation
  2. Global Trends of IC Package Molding CAE Technology, Dr. Jim Hsu, CoreTech System (Moldex3D)
  3. Quick decision of System In Package implementation for IoT/5G era, Yoko Fujita, Zuken
  4. Mentor: System-level, post-layout electrical analysis for heterogeneous high-density advanced packaging (HDAP), Dr. Dusan Petranovic, Mentor, A Siemens Business
  • Discussion & wrap up (15 minutes)
For more information, visit the IMPACT website