Start Date: 10/2/2018 2:30 PM CET
End Date: 10/2/2018 3:30 PM CET
This is the second in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. The free event will feature Jan Vardaman and Grace O’Malley and the presentations were first given at the IMAPS MicroTech 2018 Annual Conference.
More information and registration
Advanced Packaging—Where Have We Been And Where Are We Going? - E. Jan Vardaman, TechSearch International, Inc.
Future Direction, Challenges and Technologies - The times they are a changin’…
- Review of current advanced packaging trends
- The impact of mobile phones, cryptocurrencies, smart factories, autonomous vehicles and big data
- What does the future hold for packaging and assembly?
– Grace O’Malley, International Electronic Manufacturing Initiative (iNEMI)
- Recent market trends
- Industry direction and critical needs
- Key materials challenges in advanced packaging
The global, ever-increasing, diversity of data-driven applications and products, in parallel with the constant demand for both lower cost and higher performance, is driving packaging technologies to evolve faster than ever before. The advanced packages of the near future will be enabled by heterogeneous integration by architecture, device types, materials, manufacturing processes and test technologies. The iNEMI Technology Roadmap, updated every 2 years, provides focus and direction to the electronics supply chain on critical technology trends and needs. This presentation, based on the 2017 Packaging and Components Substrates chapter, will review the key market drivers and trends, as well as the anticipated challenges in designing and manufacturing packaging technologies for new device needs over the next 10 years; Key areas such as materials development and manufacturing capabilities will be discussed.
is Vice President of Global Operations for the International Electronic Manufacturing Initiative (iNEMI), not-for-profit, highly efficient R&D consortium of leading electronics manufacturers, suppliers, associations, government agencies and universities.