Advancing Manufacturing Technology

Event Calendar

Sunday, October 14, 2018

iNEMI Presentations at SMTA International 2018

Start Date: 10/14/2018 8:30 AM CDT
End Date: 10/18/2018 4:30 PM CDT

Venue Name: Donald E. Stephens Convention Center

Location:
Rosemont, IL  United States 

Marc Benowitz and Grace O’Malley will both be attending SMTAI this year. Please email if you would like to meet with either of them while at the conference.

iNEMI will be presenting in several areas at SMTA International 2018.

Monday, October 15
Harsh Environments Track
Session HE1 - Predicting Component Life for Harsh Environments (8:30-10:00 a.m.)
8:30-9:00 a.m. - Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
     Presenter:  Chen Xu (Nokia Bell Labs)

Technical Innovations Track
Session TI2 - Industry 4.0: Why Do We Need It? (10:30 a.m. - 12:00 p.m.)
10:30-11:00 a.m. - iNEMI Industry 4.0 Roadmap (Smart Manufacturing)
     Presenter:  Ranjin Chatterjee (Cimetrix)
11:30 a.m. - 12:00 p.m. - Panel Discussion
     Moderator: Trevor Galbraith
     Panelists:
       Ranjan Chatterjee (Cimetrix)
       Irene Sterian (Celestica)
       Gregory Vance (Rockwell Automation)

Tuesday, October 16
Advanced Packaging Technology Track
Session APT2 - Assembly and Reliability of Bottom Termination Components (2:00-4:00 p.m.)
2:00-2:30 p.m. - The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages
     Presenter:  Richard Coyle (Nokia Bell Labs)

Thursday, October 18
Lead-Free Symposium
Session LF1 - Low Temp Solder Paste and Its Process Development (8:00-9:30 a.m.)
8:00-8:30 a.m. - iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV:  Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints
     Presenter:  Raiyo Aspandiar (Intel)

Lead-Free Symposium
Session F2: High Reliability Pb-free Alloys, SAC305 and Beyond (10:00 a.m. -  12:00 p.m.)
11:00-11:30 a.m. - Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys
     Presenter: Richard Coyle (Nokia Bell Labs)

Lead-Free Symposium
Session F4: Reliability of Doped Sn Based Lead-Free Alloys  (3:00-4:30 p.m.)
4:00-4:30 p.m. - The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys
     Presenter: Richard Coyle (Nokia Bell Labs)