Advancing Manufacturing Technology

Event Calendar

Tuesday, October 1, 2019

iNEMI/IMAPS Special Session

Start Date: 10/1/2019 6:00 PM EDT
End Date: 10/1/2019 8:00 PM EDT

Venue Name: Hynes Convention Center

Location:
900 Boylston St
Room #207
Boston, MA  United States  02115

iNEMI/IMAPS Special Session
Design and Test Challenges of SiP and Advanced Packages
Date and Place: Tuesday, Oct 1, 6-8PM
Place: Hynes Convention Center
Room: 207
This meeting will be held in conjunction with the IMAPS 52nd International Symposium in Microelectronics
 
Please join us with a group of industry experts to discuss and set the direction for future solutions. This “brainstorming” session is a follow up from the interest among the panelists and the audience at the IMAPS Advanced SiP panel session that was held in Monterey, CA on 6/27/2019.

  • Topics for discussion:
    • Design Infrastructure
      • System-Package-PCB co-design
      • Managing different libraries and multiple domains
      • Electrical, mechanical and thermal analyses
    • Test infrastructure
      • Test insertion choices and cost-benefit analysis
      • Application specific testing (mixed signal, digital etc)
      • Self testing (BIST, Boundary scan
      • System level test (SLT)
  • Given the challenges facing the supplychain to enable successful implementation for SiP and other advanced packaging technologies. This is an opportune moment for the industry to come together to generate a common guideline, working in a collaborative model
  • Expected outcome
    • Overall industry feedback collection
    • Prioritization on the gaps that need to be addressed
    • Launch or Define collaborative industry project(s) to generate guidelines for design and test flows for SiP and/or other advanced packages, as appropriate
Attendance is free, but space is limited. Please register here
          
Light refreshments and beverages will be provided.