Start Date: 1/27/2021 8:00 AM EST
End Date: 1/27/2021 9:00 AM EST
Packaging TIG Technical Sharing: Panel Level Packaging (members only)
January 27, 2021
8:00-9:00 a.m. EST (Americas)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Log-in details (members only; requires member web account)
Panel level packaging (PLP) is an essential technology that supports advanced heterogeneous system-in-package solutions.
The January meeting of iNEMI’s Packaging Technology Integration Group (TIG) will feature Cheng-Ta Ko (Unimicron) who will highlight trends and challenges of fan-out panel level packaging (FO-PLP) technologies. The session will also identify opportunities for potential collaboration.
This meeting is open to all iNEMI members.