Dr. Fu Zhao, Purdue University
Tom Okrasinski, Nokia
Call for Participation Webinar
Session 1 - March 13th, 11:00 a.m. EDT (Americas) / 4:00 p.m. CEST (Central Europe)
Session 2 - March 14th, 9:00 a.m. CST (China) / 10:00 a.m. JST (Japan)
Statement of Work and Project Statement
Click here to view Project Statement
Click here to view Statement of Work
Steps for Joining the Project
Sign-up by March 29, 2019 to be a project founding member. New project participants can only join after this date if approved by the founding members.
- iNEMI Members:
- Download and review the Project Statement and Statement of Work
- Email the signed Project Statement to firstname.lastname@example.org for execution
- Option 1: Become an iNEMI member and be able to participate in all iNEMI projects, committees and activities, including having access to the iNEMI Roadmap. For further details on the benefits of membership to your organization please click here and/or contact the iNEMI contact in your region.
- Option 2: Participate as a non-member fast turnaround project participant. This allows participation for your organization in this iNEMI project only. You will be entitled to the same results as an iNEMI member. Non-member participation requires the execution of an MOU between your organization and iNEMI, and payment of the fast turnaround project fee within 45 days. If your organization becomes an iNEMI member within 12 months of the MOU execution, this fee will be credited towards your first year of membership. For further details please contact Mark Schaffer.
This project will update and expand on iNEMI’s previously developed Eco-Impact Estimator tool which enables extremely efficient and accurate LCA (life cycle assessment) estimates for two key greenhouse gas emissions component categories: bare printed wiring boards and large integrated circuits Having a simple and straightforward tool that is usable by industry for major ICT (information and communication technology) components allows for better evaluation of a product’s environmental footprint.
The overall object for the Phase 3 project is to update the existing tool and test its functionality. This approximately year-long effort will greatly enhance the tool/framework for more general use, with the following proposed topics:
The team will need to define the component categories, collect data sets, and improve on the algorithms and methods for estimating eco-impact. PWBs, ICs, power supplies, cable assemblies, fan trays, passive components and mechanical subassemblies are on the table for inclusion (or updating) within the tool (which is currently limited to greenhouse gas emissions related to global warming potential).
- Update and expand on the ICT components covered
- Investigate inclusion of other environmental aspects such as energy and water usage
- Address new and existing datasets –
- The HDPUG industry consortium has recently completed work on PWB LCA estimation of contemporary manufacturing of conventional and HDI type boards
- ICT industry developed data sets for specific components as identified by the project team
- Allow targeted users general access so product evaluations and case studies can be input and maintained within the tool (specifics for access, security, and product / case study information propriety protection will need to be fully developed and confirmed)
- Expand product sets and refine algorithms and methods for estimating eco-impact
For Additional Information