Advancing Manufacturing Technology

iNEMI Publishes Flexible Hybrid Electronics, Organic PCB and Portable & Wireless Roadmap Chapters

MORRISVILLE, NC (January 24, 2020) — The International Electronics Manufacturing Initiative (iNEMI) has released three additional chapters from its 2019 Roadmap: Flexible Hybrid Electronics, Organic PCB and Portable & Wireless.
 
Chapter Highlights
 
Flexible Hybrid Electronics — This chapter addresses the technology needs and challenges of electronics systems that can bend, fold and stretch while preserving the full operational integrity of traditional electronic architectures. It discusses how advanced packaging and bare die system design are giving rise to a new field with a supporting supply chain, and it provides an update on the trends that are moving flexible electronics toward larger scale manufacturing. The chapter also reports on the latest developments in enabling technologies, such as functional inks, substrates, thin and ultra-thin die, manufacturing processes and characterization tools.
 
Organic PCB — The Organic PCB chapter summarizes the technology needs for rigid PCBs, flexible circuits and optical circuits. It discusses the growing complexity of components which drives the need for complex multilayer PCB constructions, including micro-via interconnects and very fine features. It also looks at specialized materials and fabrication techniques, such as mSAP, which are required for high-speed processors and applications. Additional topics include development of optical PCBs and the associated manufacturing challenges; specific product demands of 5G communications; and how advanced technologies used for organic semiconductor packaging substrates are being adapted for advanced HDI PCBs. This chapter release updates and replaces the previously published 2019 Organic PCB chapter. Anyone who purchased the earlier version of the chapter will be provided this update for free. 
 
Portable & Wireless — This product sector chapter discusses the key factors that have enabled portable and wireless devices to continue to be strong volume drivers of overall electronics manufacturing. It considers a variety of key products and services and how these products demand innovations in advanced packaging and design (e.g., the adoption of artificial intelligence and machine learning, which are exponentially increasing the functionality of premium-tier smartphones). Additionally, the unique challenges of 5G mmWave based communications protocols ­— which are expected to drive disruptive changes in packaging, test strategies and integration trends in smartphone chipsets — are addressed. The impact on co-design and tool needs, as well as shifts in the supply chain structure, are also discussed.
 
Now Available
The 2019 Roadmap is now available on the iNEMI website. It is free for iNEMI members and chapters are $500 each for non-members. Special pricing is available for non-profit organizations, including universities, research institutes and government agencies. For additional information: https://www.inemi.org/2019-roadmap-overview 
For the 2019 Roadmap, chapters are being published in waves, with new chapters released every few weeks. The following 16 chapters are also available: Aerospace & Defense; Board Assembly; Ceramic Interconnect & Photovoltaics, Connectors, High-End Systems; Industrial Internet of Things; Mass Data Storage; Medical; MEMS & Sensors; Modeling, Simulation & Design Tools; Optoelectronics; Passive Components; Power Conversion Electronics; Semiconductor Technologies; Smart Manufacturing; and Sustainable Electronics.
 
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of approximately 80 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina (in the Greater Raleigh/Research Triangle Park area). For additional information about iNEMI, visit http://www.inemi.org.
 
For additional information:
Cynthia Williams
cwilliams@inemi.org
+1 (207) 671-7780