An iNEMI working group is currently meeting to identify industry needs and potential collaborative projects in 5G materials assessment and characterization. Areas identified for possible investigation include:
If you are interested in getting involved in defining the focus for this new initiative, please contact Urmi Ray (firstname.lastname@example.org).
Packaging Challenges & Opportunities for 5G Applications
Electronics Packaging Technology Conference (EPTC)
December 4, 2019; Singapore
iNEMI co-organized a session at EPTC that featured a diverse panel of speakers who outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session has contributed to the development of iNEMI’s initiative on 5G mmWave material characterization and testing.