Say Phommakesone, Keysight
Dr. Chang-Sheng Chen, ITRI
Access Reports 1 & 2
Please note: these reports are for members only and require log-in.
- 5G Materials Assessment and Characterization Project Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020)
- 5G Materials Assessment and Characterization Project Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020)
Call for Participation
SOW & Project Statement
Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction.
The goal of this project is to develop a guideline/best practice for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.
The project will have two distinct phases:
- Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz
- Phase 2: Extend the guidelines to PCB/substrate level characterization
Call-for-Participation Webinar Presentation
(June 4 & 5, 2020)
Packaging Challenges & Opportunities for 5G Applications
Electronics Packaging Technology Conference (EPTC)
December 4, 2019; Singapore
iNEMI co-organized a session at EPTC that featured a diverse panel of speakers who outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session contributed to the development of iNEMI’s initiative on 5G mmWave material characterization and testing.