Advancing Manufacturing Technology

2017 iNEMI Technical Plan

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2017 iNEMI Technical Plan
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Development of the iNEMI Technical Plan, along with the Research Priorities, is a continuation of the roadmapping process. The roadmap identifies technology gaps and needs.  Follow-up "gap analysis" by iNEMI's Technology Integration Groups (TIGs) helps prioritize those needs and identifies the ones that can most effectively be addressed through industry collaboration.

The purpose of the iNEMI Technical Plan is to provide a concise, yet complete, presentation of the gaps between present industry capabilities as represented by state-of-the-art-practices, and future industry needs as forecast by the iNEMI Roadmap. A members-only document, the Technical Plan lays out a five-year plan that defines the projects and activities deemed necessary to close the identified gaps. These plans become the basis for iNEMI projects.

Efforts to close the identified technology gaps are undertaken by iNEMI’s TIGs in the areas of board assembly, medical electronics, optoelectronics, printed circuit boards, substrates and packaing, sustainable electronics, and test.

After the biennial roadmapping activities are completed and technical direction is established, each TIG conducts a gap analysis, based on the needs identified in the roadmap, to define and prioritize the gaps to be addressed.

The Technical Plan is a culmination report of the implementation cycle activities, and focuses on the TIGs’ priorities, plans, and prospects.