February 5, 2020
1:30 PM - 5:00 PM
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iNEMI Session at IPC APEX EXPO 2020 |
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February 10, 2020 – February 13, 2020
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iNEMI Presentations at SMTA Pan Pacific Microelectronics Symposium |
February 12, 2020
8:00 AM - 9:00 AM
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Webinar: Packaging Technical Plan, Session 2 (members only) |
February 12, 2020
10:00 AM - 11:00 AM
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Webinar: Packaging Technical Plan, Session 1 (members only) |
February 13, 2020
1:40 PM - 2:40 PM
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iNEMI Presentation at EIPC’s 2020 Winter Conference |
February 19, 2020
10:00 AM - 11:00 AM
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End-of-Project Webinar: New Packaging Technology Qualification Methodology Project (Session 2-Americas and EMEA) |
February 19, 2020
10:00 AM - 11:00 AM
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End-of-Project Webinar: New Packaging Technology Qualification Methodology Project (Session 1-APAC) |
February 19, 2020
10:00 AM - 11:00 AM
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Sustainable Electronics TIG – Members Report (Session 1) |
February 19, 2020
8:00 PM - 9:00 PM
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Sustainable Electronics TIG – Members Report (Session 2) |
March 5, 2020
8:00 AM - 9:00 AM
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Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project Webinar for Phase 2 End of the Project and Phase 3 Call for Project Participation - Session 2 (Americas and EMEA) |
March 5, 2020
10:00 AM - 11:00 AM
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Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project Webinar for Phase 2 End of the Project and Phase 3 Call for Project Participation - Session 1 (APAC) |
April 23, 2020
10:10 AM - 11:10 AM
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iNEMI Technical Session at ICEP |
April 23, 2020
12:30 PM - 2:30 PM
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iNEMI Session at SMTA Electronics in Harsh Environments |
