Date(s): April 24, 2019
Time: 9:45 AM CST - 5:15 PM CST
Held at 2019 SMTA China East Technology Conference (in conjunction with NEPCON China 2019)
Meeting room #9
Organized by: iNEMI
Co-organizer: SMTA China, Reed Exhibition
$120 USD / ¥900 CNY
(Fee is waived for invited speakers.)
Registration is due April 18; onsite registration will not be available.
Registration fee covers workshop presentations, lunch coupon, and refreshments.
NOTE: Registration payments can be made in U.S. dollars via credit card, or in Chinese Yuan (CNY) by wire transfer. (The amount charged for wire transfer registration includes tax and service charge, and an invoice will be provided.) If you need a Chinese formal invoice, please download the registration form and make CNY wire transfer.
To register by credit card, click on the appropriate registration button above.
Click here for wire transfer instructions and form.
|9:30 – 9:45||Sign for workshop attendance|
|9:45 – 10:00||“Welcome and Workshop Overview”, Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI|
|10:00 – 10:30||“Surface Mount Technology Using Low Temperature Soldering”, Kok Kwan Tang, CPTD Technical Program Manager, Intel|
|10:30 – 10:55||“Low Temperature Solder Alloy System in Electronic Packaging”, Dr. Jun Shen, Professor, PhD Advisor, Chongqing University|
|10:55 – 11:20||“iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability Project Report”, Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI|
|11:20 – 11:45||“Low Temperature Solder Overview”, Jacky Zhang, Global Supplier Quality Manager, Dell|
|11:45 – 13:00||Lunch|
|13:00 – 13:25||“Development of Low Temperature Solder for Next Generation SMT”, Naoki Kubota, Technical Sales Specialist, Tamura|
|13:25 – 13:50||“Low Temperature Solder for SMT”, Domini Zhang, Operations Engineering Manager, Flex|
|13:50 - 14:05||Tea break|
|14:05 – 14:30||“Advanced Low Temp Lead-free Solder for SMT Assembly”, Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology|
|14:30 – 14:55||“High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies”, Annie Yang, Regional Marketing Manager – China, MacDermid Alpha|
|14:55 – 15:20||“Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges”, Dr. Panju Shang, Senior Engineer, Huawei|
|15:20 - 15:30||Tea break|
|15:30 – 15:55||“Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint Evaluation", Qin Chen, R&D Manager, Eunow|
|15:55 – 16:20||“High Speed Shear Results of Low Temperature Solder”, Dr. Xin Wang, SMT Lab Associate Manager, Quanta|
|16:20 – 17:00||Panel discussion|
|17:00 – 17:15||Wrap up|