How Projects are Formed
Technology Integration Groups (TIGs)
Board Assembly TIG
Medical Electronics TIG
Optoelectronics TIG
Packaging TIG
PCB & Laminates TIG
Sustainable Electronics TIG
Test, Inspection & Measurement TIG
- Characterize and Quantify the Production Inspection Capability of the AXI of HiP (Head in Pillow) Defects
- Investigation into Challenges of Using .BSDL Files (Boundary Scan, Phase 3)
Automotive Electronics
MEMS Technology
Miscellaneous
Smart Manufacturing TIG
5G Electronics

Login

Members

Investigation into Challenges of Using .BSDL Files (Boundary Scan, Phase 3)

Project Objective

The scope of work for this project will be to develop an industry survey to determine if issues associated with IEEE 1149.1 .bsdl files identified in the 2009 iNEMI Boundary-Scan survey still exist, and if so to what extent, and identify any new issues. Based on the data obtained, the results will be used to raise industry awareness of the issues and potential solutions. Best practices for .bsdl file creation and validation will be identified and documented.

Statement of Work and Project Statement

Statement of Work (Version 1.2, February 14, 2013)
Project Statement (Version 1.2, February 27, 2013)
iNEMI membership is required to participate in this project. The period for becoming a founding member for this project closed on May 10, 2013.

For Additional Information

infohelp@inemi.org

Advancing Manufacturing Technology