Raiyo Aspandiar and Scott Mokler (Intel)
Statement of Work and Project Statement
Recently there have been some drivers from most ODMs and some OEMs to adopt low-temperature soldering for the assembly of consumer electronic products, such as cell phones, tablets and mobile computers. The motivations for these drivers have been three fold: environmental, economic and technical.
The purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards.
PresentationsiNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components, presented by Raiyo Aspandiar (Intel Corporation), SMTA International, September 26, 2019; Rosemont, Illinois.
iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints; presented by Raiyo Aspandiar (Intel), SMTA International, October 18, 2018 (Rosemont, Illinois)
Presentation and Paper: iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes — Part III: mechanical shock tests on PoP BGA assemblies, Jagadeesh Radhakrishna (Intel), presented at ICEP-IAAC 2018 (April 19, 2018; Kuwana, Mie, Japan) (iNEMI members only)
iNEMI Project on Process Development of BiSn-Based Low-Temperature Solder Pastes - Part II: Characterization of Mixed Alloy BGA Solder Joints; Raiyo Aspandiar (Intel); Pan Pacific Microelectronics Symposium (February 6, 2018; Big Island, Hawaii)