Board Assembly TIG

Active Projects and Initiatives

• 5G Test Methodology Challenges (in development)
• BiSn-Based Low-Temperature Soldering Process and Reliability
• Characterization of Third Generation High-Reliability Pb-Free Alloys
• Connector Reliability Test Recommendations, Phase 3 (new project)
• Electromigration in Low Temperature Solder at Board Level (in development) 
• Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs) (in development)
• PCBA Materials for Harsh Environments, Phase 2 
• QFN Package Board Level Reliability 
• Smart AOI Inspection: Demonstrating Capabilities & Identifying Gaps/Opportunities
• Warpage Characterization and Management Program
  • High Density Interconnect Socket Warpage Prediction and Characterization 
  • Package Warpage Prediction and Characterization

Previous Projects

• Board Coplanarity in SMT
• Connector Reliability Test Recommendations
• Connector Reliability Test Recommendations, Phase 2
• Conformal Coating Evaluation for Improved Environmental Protection
• Counterfeit Components - Assessment Methodology and Metric Development
• Creep Corrosion Projects
  • Creep Corrosion, Investigation of Factors that Influence Creep Corrosion, Phase 3 
  • Qualification Test Development for Creep Corrosion, Phase 1
  • Qualification Test Development for Creep Corrosion, Phase 2
  • Qualification Test Development for Creep Corrosion, Phase 3
• Pb-Free Component & Board Finish Reliability
• Pb-Free Early Failure, Phase 2
• Pb-Free Nano-Solder
• Pb-Free Rework Optimization, Phase 3
• PCBA Cleanliness, Phase 1 
• PCBA Reliability Qualification
• PCB Warpage Characterization and Minimization
• Solder Paste Deposition
• Strain Guidance for PCBAs
• Test Strategy 
• Ultra Low Loss Laminate/PCB For High Reliability and Performance