Board Assembly TIG

Active Projects and Initiatives

• BiSn-Based Low-Temperature Soldering Process and Reliability
• Characterization of Pb-Free Alloy Alternatives
• Connector Reliability Test Recommendations, Phase 2
• PCB Warpage Characterization and Minimization 
• PCBA Cleanliness, Phase 1 
• PCBA Materials for Harsh Environments, Phase 2 
• QFN Package Board Level Reliability 
• Qualification Test Development for Creep Corrosion, Phase 3

Previous Projects

• Board Coplanarity in SMT
• Connector Reliability Test Recommendations
• Counterfeit Components - Assessment Methodology and Metric Development
• Creep Corrosion, Phase 3
• Pb-Free Component & Board Finish Reliability
• Pb-Free Early Failure, Phase 2
• Pb-Free Nano-Solder
• Pb-Free Rework Optimization, Phase 3
• PCBA Reliability Qualification
• Qualification Test Development for Creep Corrosion, Phase 1
• Qualification Test Development for Creep Corrosion, Phase 2
• Solder Paste Deposition
• Strain Guidance for PCBAs
• Test Strategy 
• Ultra Low Loss Laminate/PCB For High Reliability and Performance