Search
Advancing Manufacturing Technology
About Us
About Us
How to Join
Deployment Projects
Technical Planning
Industry Outreach
iNEMI Leaders
Contact Us
Legal Documents
Roadmap
Roadmap
Purchase 2019 Roadmap
Online Store
Members
Members
Member Meetings & Presentations
Projects
Projects
How Projects are Formed
Technology Integration Groups (TIGs)
Board Assembly TIG
Medical Electronics TIG
Optoelectronics TIG
Packaging TIG
PCB & Laminates TIG
Sustainable Electronics TIG
Test, Inspection & Measurement TIG
Automotive Electronics
MEMS Technology
Miscellaneous
Smart Manufacturing TIG
5G Electronics
Research
News Releases
Online Store
Events
How Projects are Formed
Technology Integration Groups (TIGs)
Board Assembly TIG
BiSn-Based Low-Temperature Soldering Process and Reliability
Conformal Coating Evaluation for Improved Environmental Protection
Connector Reliability Test Recommendations, Phase 2
Connector Reliability Test Recommendations, Phase 3
High Density Interconnect Socket Warpage Prediction and Characterization Project
PCB Warpage Characterization and Minimization Project
PCBA Cleanliness Project
PCBA Materials for Harsh Environments, Phase 2
QFN Package Board Level Reliability Project
Characterization of Third Generation High-Reliability Pb-Free Alloys
Medical Electronics TIG
Optoelectronics TIG
Packaging TIG
PCB & Laminates TIG
Sustainable Electronics TIG
Test, Inspection & Measurement TIG
Automotive Electronics
MEMS Technology
Miscellaneous
Smart Manufacturing TIG
5G Electronics
Login
Forgot your password?
Enter
CREATE A WEB ACCOUNT
Members
Home
Projects
Board Assembly TIG
Board Assembly TIG
Active Projects and Initiatives
5G Test Methodology Challenges
(in development)
BiSn-Based Low-Temperature Soldering Process and Reliability
Characterization of Third Generation High-Reliability Pb-Free Alloys
Conformal Coating Evaluation for Improved Environmental Protection
Connector Reliability Test Recommendations, Phase 3
(new project)
Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs)
(in development)
PCBA Materials for Harsh Environments, Phase 2
QFN Package Board Level Reliability
Smart AOI Inspection: Demonstrating Capabilities & Identifying Gaps/Opportunities
Warpage Characterization and Management Program
High Density Interconnect Socket Warpage Prediction and Characterization
Package Warpage Prediction and Characterization
Previous Projects
Board Coplanarity in SMT
Connector Reliability Test Recommendations
Connector Reliability Test Recommendations, Phase 2
Counterfeit Components - Assessment Methodology and Metric Development
Creep Corrosion Projects
Creep Corrosion, Investigation of Factors that Influence Creep Corrosion, Phase 3
Qualification Test Development for Creep Corrosion, Phase 1
Qualification Test Development for Creep Corrosion, Phase 2
Qualification Test Development for Creep Corrosion, Phase 3
Pb-Free Component & Board Finish Reliability
Pb-Free Early Failure, Phase 2
Pb-Free Nano-Solder
Pb-Free Rework Optimization, Phase 3
PCBA Cleanliness, Phase 1
PCBA Reliability Qualification
PCB Warpage Characterization and Minimization
Solder Paste Deposition
Strain Guidance for PCBAs
Test Strategy
Ultra Low Loss Laminate/PCB For High Reliability and Performance